Cellular 4G/LTE Channel

UltraSource Inc. releases new thin film microcircuit CopperVia

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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Aviat Networks joins Next Generation Mobile Networks Alliance

Aviat Networks Inc., a leading expert in microwave networking solutions, announced that it has joined the Next Generation Mobile Networks (NGMN) Alliance as an active sponsor along with a community of leading operators and manufacturers in the mobile industry. The company will also be showcasing its latest LTE proven products at the NGMN Industry Conference, which will be held June 13-15, in San Francisco, California.


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Cambridge Consultants introduces new platform for the wireless delivery of high-quality audio

A new technology platform from leading design and development firm Cambridge Consultants is enabling wireless devices such as radio microphones and intercoms to deliver high-quality audio within international license-free radio bands – even in mega-stadiums. It means Digital Enhanced Cordless Telecommunications (DECT) can now provide the same range in a large arena as it does in open spaces – typically more than 100 meters – without the problem of interference when there is a high concentration of devices.


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