RT/duroid® 5880LZ materials have the lowest Dk for a copper clad laminate available in the market today. Because of its low dielectric constant of 1.96 at 10 GHz, RT/duroid 5880LZ supports broadband applications at the microwave through millimeter-wave frequencies where dispersion and circuit losses must be minimized. It is a lightweight, PTFE-based composite optimized with a unique filler that provides very low density (1.37 gm/cm3).
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The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced its RO3730™ laminates, tailored for the special needs of high-frequency antenna designers requiring cost-effective PTFE laminates. These ceramic-filled laminate materials are reinforced by woven fiber glass with optimized glass and filler loading for excellent structural stability and outstanding electrical performance.
The Advanced Circuit Materials (ACM) Division of Rogers Corp. recently introduced RO4730™ LoPro™ laminates for base station, RFID and other antenna designs. RO4730 LoPro laminate materials combine low-loss dielectric with low-profile copper foil for reduced passive intermodulation (PIM) and low insertion loss.
Rogers Corporation has achieved another technical first with its product line of PORON® urethanes. This unique PORON material enhancement, the Dura-Shape™ option, is a layer of polyester sealed between two layers of PORON foam which will help fabricators produce highly accurate gaskets. This new product is the solution that fabricators have been seeking in terms of improved die cutting for high performance gaskets and seals.
ECCOSTOCK® SH is a rigid, closed cell, polyurethane foam which remains rigid at high temperatures. ECCOSTOCK® SH may be used at a maximum service temperature of 275°F (135°C) and at 325°F (163°C) for short periods. It is primarily used as a high temperature structural member or thermal barrier in electrical/electronic applications.