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Rogers has launched the groundbreaking RO4360 high frequency laminates, the latest addition to the RO4000® product family. RO4360 thermoset laminate materials are specially formulated to meet a Dk of 6.15 and exhibit a low dissipation factor of 0.0038 at 10 GHz. RO4360 laminates possess a Z-axis coefficient of thermal expansion of 30 ppm/°C (CTE) for dependable plated-through-hole (PTH) quality in multilayer circuit and package designs.
RFMD’s RF5755 front end module delivers a complete integrated solution for handset/handheld WLAN 802.11b/g/n and Bluetooth® systems. The module also features integrated matching circuitry with output harmonic attenuation, reducing BOM and manufacturing costs.
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Rogers has launched the groundbreaking RO4360 high frequency laminates, the latest addition to the RO4000® product family. RO4360 thermoset laminate materials are specially formulated to meet a Dk of 6.15 and exhibit a low dissipation factor of 0.0038 at 10 GHz. RO4360 laminates possess a Z-axis coefficient of thermal expansion of 30 ppm/°C (CTE) for dependable plated-through-hole (PTH) quality in multilayer circuit and package designs.
RFMD’s RF5755 front end module delivers a complete integrated solution for handset/handheld WLAN 802.11b/g/n and Bluetooth® systems. The module also features integrated matching circuitry with output harmonic attenuation, reducing BOM and manufacturing costs.
