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The FAMES Pilot Line announced the official launch of the FAMES Academy, a strategic educational initiative designed to support the EU’s commitment to develop next-generation chips.
Thin Film Interconnect (TFI), based in Frederick, Md., announced a strategic technology partnership with Heisler Semiconductor LLC, headquartered in Baltimore, Md.
The 71st annual IEEE International Electron Devices Meeting (IEDM) has issued a Call for Papers in all areas of microelectronics research and development, under the theme “100 Years of FETs: Shaping the Future of Device Innovations.”
Finwave Semiconductor, Inc. announced a new $8.2 million bridge investment round to fuel market push and unlock true potential of GaN-on-Si for 5G/6G networks.
A new collaboration between Partstat and WIN Semiconductors
aims to provide comprehensive long-term storage solutions for semiconductors, including die and wafer banking, to meet the evolving needs of the electronics manufacturing industry.
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