Semiconductors / Integrated Circuits

Major Deal for Nujira Handset Technology

Nujira has licensed its Coolteq.L handset technology to a Tier 1 semiconductor vendor in the handset ecosystem. Coolteq is an envelope tracking-based technology that increases the power efficiency of transmitters in cellular handsets, network infrastructure, digital broadcasts and military communications. Under the agreement, the vendor will integrate the Coolteq.L...
Read More

ADI Collaborates with Altera to Streamline Wireless Infrastructure System Development

Analog Devices Inc. (ADI) introduced a high-performance development platform for wireless infrastructure equipment designers who need to quickly evaluate systems using DPD (digital pre-distortion) techniques in multi-carrier cellular base stations. ADI’s MS-DPD (mixed-signal, digital pre-distortion) development platform seamlessly integrates a complete high-performance RF and mixed-signal transmit chain from ADI...
Read More

Sarantel Helps Improve GPS Receiver Designs

The Sarantel SL1203C antenna’s integrated O-Ring improves upon an already rugged, waterproof and dust-proof design of the SL1203A. It still weighs-in at only 13.4 grams, including the built-in SMA Plug. An integral DC block allows direct connection to receivers with DC voltage on the RF input. Package dimensions: 14...
Read More

ADI and Xilinx Unveil MS-DPD Platform

Analog Devices Inc. (ADI) collaborated with industry leading programmable-logic vendor Xilinx Inc. to introduce a radio architecture development platform that helps multi-carrier cellular base station manufacturers reduce engineering resources and improve time to market. ADI’s MS-DPD (mixed-signal, digital pre-distortion) development platform simplifies the wireless infrastructure design process by allowing...
Read More

Epic Communications Wins 2010 R&D 100 Awards

Epic Communications Inc. (Epicom), a fabless IC solution provider of RF front-end modules (FEM) and power amplifiers (PA) for WiFi, WiMAX and cellular sockets, announced that Epicom has won the 2010 R&D 100 award for its development of a single,flip chip-based complete wireless front-end integrated circuit (FEIC). Late last...
Read More