Semiconductors / Integrated Circuits

Rogers acm 200

Heatwave™ Metal Matrix Composites

Supplied in a range of thermal conductivities from 170 to 230 W/mK, this light-weight material is suitable for thermal base plates, heat spreaders, semiconductor packaging and pin fin heat sinks.
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Rs 253x150

Krytar Inc.

MTT-S Booth 1338
The model 110067016 is a directional coupler that operates in a frequency range from 10 to 67 GHz.
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Theta™ Printed Circuit Materials

ThetaPRRogers Corporation will feature a variety of its advanced materials solutions for the electronic design and semiconductor industries at DesignCon 2010 in Santa Clara, CA,  including Theta™ printed circuit materials, ULTRALAM® 3000 laminates, RO2808™ laminates, and RO4000® LoPro™ circuit board materials.Theta laminates and prepregs are environmentally friendly, high-performance FR-4 materials compatible with lead-free assembly processing.


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PORON® ThinStik™ Materials

ThinStikMore cushioning and sealing, less wasted space, enables thinner designs. As handheld devices decrease in size and increase in functionality, achieving the proper balance of sealing and protection with the requirements of an ultra thin application can be an extreme design challenge. To help address this need, Rogers Corporation has specifically engineered the PORON ThinStik family of self-adhesive solutions.


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4-Way Power Divider, Model 3326B-4

Narda-3326B_100Narda, an L-3 Communications company, today introduced the Model 3326B-4 four-way power divider, which operates from 6 to 18 GHz and features precise phase and amplitude balance, high port-to-port isolation, and low input VSWR. The power divider is well suited for a broad array of commercial and military applications.


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