RF & Microwave Industry News

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Teledyne SP Devices, a business unit of Teledyne Technologies Incorporated, announced the release of ADQ32—a fourth-generation modular data acquisition board optimized for high-throughput applications.

Qualcomm Technologies, Inc. announced the Qualcomm 5G fixed wireless access (FWA) platform gen 2, powered by the fourth-generation Qualcomm® Snapdragon™ X65 5G Modem-RF System, will enable new business opportunities for mobile operators by allowing them to offer fixed internet broadband services to homes and businesses using their 5G network infrastructure.

Qualcomm Technologies, Inc. announced its next-generation of Qualcomm® RF Front-End (RFFE) solutions for high performance 5G mobile devices.

Qualcomm Technologies announced the Snapdragon X65 5G Modem-RF System, its fourth-generation 5G modem-to-antenna solution, the first 10 Gigabit 5G and the first 3GPP release 16 modem-RF system.

Elbit Systems Ltd. announced that it was awarded an approximately $82 million contract from BAE Systems Hägglunds AB (BAE Systems Hägglunds) to supply the Royal Netherlands Army (RNLA) with Active Protection Systems (APS) and electro-optical commander sights.

Renesas Electronics Corp. of Japan has agreed to acquire Apple Inc. supplier Dialog Semiconductor Plc, the latest U.K.-based chipmaker being sold to Asian investors. Dialog accepted the all-cash offer of about 4.9 billion euros ($5.9 billion), at 67.50 euros per share, the companies said in statements Monday. Dialog shares rose as much as 18% in early trading in London on Monday. Renesas shares dropped as much as 6.9% in Tokyo.