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Palomar Technologies announced the availability of their new Palomar 8100 Wire Bonder. The new 8100 wire bonder is a fully automated, thermosonic high speed ball-and-stitch wire bonder capable of ball bumping and customized looping profiles.
Kymeta announced that the FCC has granted blanket authorization for the operation of its next-generation electronically steered, flat-panel Earth station in motion (ESIM) platform, the Kymeta™ u8 terminal.
Orolia Defense & Security has been granted security approval by SMC Production Corps. for BroadSim modernized navstar security algorithm (MNSA). BroadSim is the only software-defined GNSS simulator on the market to receive such approval, marking an industry first.
ZTE Corporation has completed the industry's first mmWave over-the-air (OTA) performance test. It is an end-to-end test based on multi-probe darkroom test system pioneered by China Academy of Information and Communications Technology (CAICT) and China Mobile Research Institute.
Finnish telecommunications service provider, Elisa, has selected Ericsson for a comprehensive 5G technology deployment spanning 5G Core and 5G radio access network (RAN).
ZTE Corporation has launched the industry’s first broadcast service based on the 5G NR physical layer technology at Ultra High Definition Video (Beijing) Production Technology Collaboration Center, realizing end-to-end 5G HD video broadcast service on 700 MHz spectrum.
For over two decades IPD has been a technology with considerable promise, just waiting for mass implementation. Yole Développement has scrutinized this technology over the past eight years to assess its penetration and potential evolution. In this context, Yole releases the Thin-Film Integrated Passive Devices 2020 report.
Keysight Technologies, Inc. has collaborated with MediaTek to achieve physical layer interoperability development testing (IODT) based on 3GPP release 16 specifications.
Pentek, Inc. introduced a board to the Quartz® RFSoC Architecture family, the Model 5903, a 3U VPX high-speed synchronizer and distribution board, optimized for Pentek products using the Xilinx Zynq® UltraScale+ RFSoC.