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Researchers at HRL Laboratories are aiming for a disruptive improvement in radar, electronic warfare and communications by developing a W-Band, N-polar GaN low noise amplifier.
Adding to its capabilities in UWB technology for mobile, Qorvo® has acquired Paris-based 7Hugs Labs, a software provider for UWB applications, for $48.7 million. Qorvo sees UWB enabling new location and communication services based in the smartphone.
STMicroelectronics announced the acquisition of a French fabless company, SOMOS Semiconductor (SOMOS), specialized in RF power amplifiers (PAs) and RF front-end modules (FEM) based on the mainstream complementary metal-oxide semiconductor (CMOS) technology.
In light of the global pandemic, growing numbers of cases in Europe, and related measures imposed by the respective authorities, European Microwave Week (EuMW) organizers have decided to make EuMW 2020 a virtual event this year while simultaneously planning for the next in-person event in London in October of 2021.
u-blox has announced the u-blox M10, its latest highly integrated global navigation satellite system (GNSS) platform designed fully in-house for ultra-low power high performance positioning applications.
Modelithics announced the release of the Modelithics Library v20.6 for the Cadence Spectre Simulation Platform. Version 20.6 includes over 330 models from nearly 30 vendors, representing more than 21,000 components.
Richardson Electronics, Ltd. strengthens its RF offering with Masach Tech™ EMI/RFI shields. These rigid, very planar parts are designed for reflow solder and have a removable lid to allow for much easier component troubleshooting and repair.
Keysight Technologies, Inc. announced that the company was first to be approved by the Global Certification Forum (GCF) for 5G universal subscriber identity module (USIM) application toolkit (USAT) test cases.
GLOBALFOUNDRIES® (GF®) and Soitec announced a multi-year supply agreement for 300 mm radio frequency silicon-on-insulator (RF-SOI) wafers, allowing GF to further expand its critical role in providing solutions for the next-generation mobile phone market.
Qorvo® has been selected by the U.S. government to create a state-of-the-art heterogeneous integrated packaging (SHIP) production and prototyping center for RF assemblies, a program valued at $75 million.
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