RF & Microwave Industry News - Articles - Page 578

Keysight’s Open RAN Studio Selected by Kyocera

To be Used for Radio Units Validation in Compliance to O-RAN Specifications

June 9, 2021

Kyocera Corporation has selected Keysight's Open RAN Studio software to validate O-RUs in compliance to specifications set by the O-RAN Alliance and accelerate development of O-RUs.

NXP’s Development Tools Enable New Ultra-Wideband Applications for iPhone and Apple Watch

June 9, 2021

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NXP Semiconductors N.V. announced that it now offers beta ultra-wideband (UWB) development tools from its NXP Trimension™ portfolio that interoperate with the U1 chip in supported Apple products.

Marki Microwave's Surface Mount Bias-Tee Spans 26 GHz Supported by RFMW

June 9, 2021

RFMW

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The Marki Microwave BTL-0026SMG-2 bias-tee uses a proprietary wire-wound coil for ultra-broadband, resonance-free operation from 500 kHz to 26 GHz.

Nokia, Qualcomm and UScellular Hit Extended-Range 5G World Record Over mmWave

June 9, 2021

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Nokia, Qualcomm Technologies, Inc. and UScellular achieved a world record for extended range over mmWave of more than 10 km utilizing its 5G extended range mmWave solution on a commercial network.

Carlisle Interconnect Technologies’ Solutions Now Available For 5G/Gen-Z Networks and System

June 9, 2021

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Carlisle Interconnect Technologies announced that it is now offering high performing, low-cost cable assemblies, connectors and interconnect systems for 5G and Gen-Z systems

T|Tech,Inc. Announces New Website & Release of IsoPro® 6.0

June 9, 2021

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T|Tech,Inc. announced the release of their new website, t-tech.com, and the release of IsoPro® 6.0 software which allows users to manufacture printed circuit boards on the Quick Circuit, in house, in an hour from the time the schematic and layout are produced.

Guerrilla RF Hits the 100M+ Mark in RFIC/MMIC Deployments

June 9, 2021

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Guerrilla RF (GRF) announced that it has surpassed the 100 million milestone for RFIC/MMIC deployments in less than six years after releasing its first product.

Remcom Introduces Transient EM/Circuit Co-Simulation for TVS Diode ESD Protection Analysis

XFdtd® 3D EM Simulation Software

June 9, 2021

Remcom

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Remcom updated its XFdtd® 3D EM Simulation Software with transient EM/circuit co-simulation for electrostatic discharge (ESD) testing and support for transient voltage suppressor (TVS) diodes and spark gaps.

3D Glass Solutions Locks Process Flow for Integrative Passive Device Technology Node Process Design Kit

June 8, 2021

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3D Glass Solutions' locked process flow marks the industry’s first glass ceramic-based IPD technology node and complimentary PDK, streamlining custom design and fabrication of high performance RF devices.

Parallel Wireless Announces Industry Leading Open RAN Ecosystem at MWC21 Barcelona

June 8, 2021

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