3D Glass Solutions (3DGS) announced it has locked the process flow for its integrated passive device (IPD) technology node and solidified the IPD design rules in a process design kit (PDK) available for customer release. The locked process flow marks the industry’s first glass ceramic-based IPD technology node and complimentary PDK, streamlining custom design and fabrication of high performance RF devices.

“Our powerful PDK software delivers over 95 percent simulation alignment to the final IPD product, which is unheard of in the RF community,” said Mark Popovich, CEO of 3DGS. “This high alignment rate can be attributed to our unique glass ceramic platform and its ability to limit parasitic losses, which are often difficult to simulate. Our team is thrilled to have locked the process flow for this industry leading technology and we are ready to make it available to our customers.”

The glass ceramic-based IPD technology is a low loss RF platform technology that significantly reduces power consumption in RF devices. Featuring high-quality inductors with Q-factors over 90 and high-quality capacitors with values over 250, the IPD technology node is ideally suited for frequencies between 0.1 and 10 GHz. 3DGS’ locked process flow significantly shortens manufacturing through put time for reduced time to market. The technology node’s high yield, scalable process delivers a high correlation between simulation and final product for expedited product development. Designed in a compact, highly integrated electronic package, the IPD technology node can be used for the creation of:
• Filters
• Diplexers
• Couplers
• Bias tees
• Switch-bank filters
• Matching networks for GaN power amplifiers

The IPD technology node PDK is available for download now. 3DGS is attending the 2021 Internal Microwave Symposium, in Atlanta, Ga. Visit us at booth 1521 to learn more.