Industry News

RSS

AMCAD Engineering announced the upgrade of its PIV semiconductor device analyzer family for the next generation of High Voltage Fast Switching (HVFS) Transistors.

EMSCAN will showcase the world's largest real-time antenna pattern measurement tool in Amsterdam at  EuMW 2012.

Agilent Technologies Inc. announced the webcast, “Calibration: Why It Matters and What It Should Include,” hosted by Bob Stern, senior metrologist and Agilent Electronic Measurement Group representative to NCSLI. The webcast will be held Nov. 8.

Florida RF Labs has added broadband resistive power dividers to the HybriX® line of signal distribution products. The new RPD series offers significant advantages over on-board multi-resistor design by providing excellent broadband frequency response, highly repeatable performance, and streamlined assembly process in a monolithic surface-mountable chip package.

Agilent Technologies Inc. announced that EMPro 2012 will be demonstrated at European Microwave Week (Booth 114), Oct. 29-Nov. 1, RAI, Amsterdam.

RF Micro Devices Inc., a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, announced the appointment of Alan Hallberg as the company's corporate vice president and chief marketing officer (CMO). In the role of CMO, Hallberg will oversee RFMD's global marketing activities and will be based in RFMD's growing Silicon Valley, CA, location.

As wireless connectivity attach rates increase in many markets and OEMs continue to push for cost savings, IC vendors such as Broadcom, Qualcomm, TI, Marvell, MediaTek and others, have created integrated wireless connectivity solutions to gain market share. These solutions known as Wireless Connectivity Combo ICs have already seen rapid adoption in smartphones and are now seeing strong usage growth in many other end applications including laptops, flat panel TVs, and automotive infotainment systems.

Aeroflex Ltd., a wholly owned subsidiary of Aeroflex Holding Corp., announced that the TM500 LTE-A Test Mobile now supports carrier aggregation for Time Division Duplex (TDD), in addition to its existing Frequency Division Duplex (FDD) capability. Carrier aggregation, a key component of LTE-A, allows multiple carriers comprised of either contiguous or non-contiguous spectrum to be added together, allowing wider channel bandwidths - and higher data rates - to be achieved.

Agilent Technologies Inc. announced the launch of a new web portal that allows customers to manage their relationship with Agilent and receive information personalized to their interests and the products they own.

Vishay Intertechnology Inc. introduced the industry's first wirebondable thin film chip resistors with compact 40 x 40 mil (1 x 1 mm) footprints to feature high resistance to 100 MΩ. The new CS44 <http://www.vishay.com/doc?60114> series features low TCR down to ± 50 ppm/°C and tolerances to ± 0.5 %.