Articles Tagged with ''packaging''

TJ Green Associates LLC announced it will be offering a three day microwave packaging technology course at the Holiday Inn Conference Center, Boxborough, Mass., May 6-8th, 2015.

 TJ Green Associates will be offering a one-day LTCC Packaging Technology course at the NATEL Ceramic Plant in Carlsbad, Calif. on October 9, 2014. 

TJ Green Associates LLC announced it will be offering a three day microwave packaging technology course in Boston, May 7-9th.

IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies. 

Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.

Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore. 

Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.

Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12. 

Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, and Dr. Ron Lasky, senior technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, CA.