Articles Tagged with ''NXP''

NXP® Semiconductors announced a new series of RF power discrete solutions for 32T32R active antenna systems, complementing NXP’s existing portfolio of discrete GaN power amplifier solutions for 64T64R radios. 

NXP® Semiconductors announced that NXP’s Layerscape® and Layerscape Access family of processors have been chosen by Compal Electronics to power its new 5G integrated small cell solution. 

Richardson RFPD, Inc announced the availability and full design support capabilities for several new RF power multi-chip modules and the RapidRF demonstration platform from NXP Semiconductors.

NXP’s new single-chip NFC solutions provide security, dual-mode tamper status detection and battery-free sensing for IoT applications.

Anokiwave, NXP, YTTEK and Semicomm together demonstrated a complete 5G RU from baseband to mmWave using the O-RAN open architecture at a joint seminar recently held in Taiwan.

NXP® Semiconductors has announced that its WLAN8101H and WLAN8201C front-end modules (FEMs) enable Wi-Fi 6 connectivity in the Samsung Flip 3. 

NXP's new BTS6302U/6201U pre-drivers and BTS7203/5 dual-channel receive front-end modules reduces 5G operating costs with low-power consumption.

The new NXP automotive wireless charging reference design is the first to be certified by the Wireless Power Consortium for the new Qi 1.3 standard.

The A3M39TL039 is a 28 V, 50 ohm matched integrated Doherty LDMOS Multi-Chip Module covering the cellular infrastructure bands between 3700 to 3980 MHz.

The BTS6201U amplifier delivers high linearity with 27 dBm typical P1dB output power in its frequency range of 2300 to 4200 MHz.