Articles Tagged with ''semiconductor''

MPI Corp.is partnering with Rohde & Schwarz to provide customers with turnkey solutions for measurements on semiconductor components in the RF and millimeter-wave ranges.

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, announced William M. Holt, executive vice president and general manager of the Technology and Manufacturing Group (TMG) at Intel, has been named the 2015 recipient of SIA’s highest honor, the Robert N. Noyce Award. SIA presents the Noyce Award annually in recognition of a leader who has made outstanding contributions to the U.S. semiconductor industry in technology or public policy. Holt will accept the award at SIA’s Annual Award Dinner on Thursday, Dec. 3. 

Cree Inc., a leader in silicon carbide (SiC) power products and gallium nitride (GaN) radio frequency (RF) devices, announced that Wolfspeed is the new name for the Power and RF division of Cree. The company announced in May that it would separate the business into a stand-alone company.

M/A-COM Technology Solutions Holdings Inc. (MACOM), a leading supplier of high-performance RF, microwave, millimeter wave and photonic semiconductor products, announced it has completed the previously announced divestiture of its Automotive business to oliv ASP Inc.(Autoliv) for approximately $100 millionin cash, plus the opportunity to receive up to an additional $30 million in cash based on the achievement of revenue-and customer order based earn-out targets through 2019.

Renesas Electronics and Audi have established a strategic relationship as part of the Audi Progressive SemiConductor Program (PSCP) to accelerate automotive innovation.

Northrop Grumman Corp. announced its participation in three Phoenix, Arizona-area conventions focused on microwave and semiconductor technology.

STMicroelectronics announced what is claimed to be the world’s first 500 Mbaud High-Symbol-Rate (HSR) satellite demodulator chip.

Anritsu Co. announces it successfully completed testing of GCT Semiconductor’s 4G LTE-Advanced chip, GDM7243Q, using Anritsu’s MD8430A signaling tester with Rapid Test Designer (RTD). GCT Semiconductor, a leading designer and supplier of advanced 4G mobile semiconductor solutions, offers an advanced FDD-TDD LTE Category 5/6/7 single chip, with the world’s first 4X4 MIMO carrier aggregation for LTE.

Microsemi Corp. a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, and Vitesse Semiconductor Corp., jointly announced that Microsemi has entered into a definitive agreement to acquire Vitesse for $5.28 per share through a cash tender offer, representing a premium of 32 percent based on the average closing price of Vitesse's shares of common stock during the 30 trading days ended March 17, 2015.