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Acorn Technologies is funding a research project led by Professor Raskin to assess and quantify the performance potential of the company’s Acorn Buried Stressor (ABS) technology for RF semiconductor manufacturing.
Renesas Electronics Corporation has entered into a definitive agreement with Celeno Communications in an all cash transaction, the acquisition significantly enhancing Renesas’ connectivity portfolio with the addition of Celeno’s industry leading Wi-Fi technologies and software expertise.
IQE plc announced the commencement of a long-term strategic collaboration with GlobalFoundries® to develop vital on Si technologies for mobile and wireless infrastructure applications.
The company, formerly known as Cree, Inc. (Nasdaq: CREE), officially launches under its new name, Wolfspeed, Inc., with the support of a comprehensive, multi-channel, integrated marketing campaign.
X-FAB Silicon Foundries is now able to support volume heterogeneous integration via micro-transfer printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint.
GlobalFoundries announced its expansion plans for its most advanced manufacturing facility in upstate New York over the coming years, including immediate investments to address the global chip shortage at its existing Fab 8 facility as well as construction of a new fab on the same campus that will double the site’s capacity.
pSemi® announced the opening of a new design center in Chennai, India, to support the company's growing demand for semiconductor products for 5G and IoT applications.
BAE Systems received a $247 million contract from the U.S. Space Force’s Space and Missile Systems Center to design and manufacture an advanced military GPS receiver and next-generation semiconductor.
