Articles Tagged with ''technologies''

UBM Tech, the daily source of essential business and technical information for decision makers in the electronics industry, will welcome thousands of influential members of the chip, package and board design communities to DesignCon 2014, January 28 – 31, at the Santa Clara Convention Center in Santa Clara, California. Recognized as the premier annual trade event and technical conference dedicated to the pervasive nature of signal integrity at all levels of electronic design, DesignCon will host Keynote Speakers from Intel, Micron Technologies and XPRIZE.  

API Technologies Corp., a leading provider of high performance RF/microwave, power, and security solutions for critical and high-reliability applications, announced today that it has received a new, $1.4 million order for TPS75 Tactical Power Supplies. The company-designed power systems, which debuted at the Association of the United States Army (AUSA) Annual meeting and Exposition in October, will be used by the U.S. Department of Defense as a lightweight, mobile power supply to support a variety of C4ISR, UAV, and mission control applications.

OEwaves Inc., a leader in innovative microwave photonic products and solutions, announced that it has been ranked among the top 20 in the world on the 2013 Semiconductor Manufacturing Patent Power Ranking by the Institute of Electrical and Electronics Engineers (IEEE).

Agilent Technologies Inc. announced that Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, has adopted Agilent EEsof EDA’s Model Builder Program and Model Quality Assurance software. Microchip Technology will use the software to create internal fabrication device model libraries or process design kits, modify external foundry libraries, and validate supported devices from internal and external sources.

While the total number of stolen vehicle tracking solutions in use globally will increase from 35.5 million in 2013 to 143 million in 2018, the share of proprietary RF based systems will decrease from 24% in 2013 to 10% in 2018.

Cree Inc. announces that Shinry Technologies, a premier high-tech enterprise focused on energy efficient applications in transportation and lighting, employed Cree’s 1200V C2M family of SiC MOSFETs in its new, high-efficiency, hybrid electric and electric vehicle (HEV/EV) power converters to achieve industry-leading 96 percent efficiency.  According to Shinry Technologies, Cree’s C2M SiC MOSFETS also enabled a 25 percent reduction in product size and reduced peak power losses by over 60 percent compared to the traditional silicon versions.

Peregrine Semiconductor Corp., founder of RF silicon on insulator (SOI) and pioneer of advanced RF solutions, and GLOBALFOUNDRIES, a leading provider of semiconductor manufacturing technology, are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies. This partnership unites Peregrine’s 25 years of RF SOI experience with a tier-one foundry.

The Boeing Co. and Lockheed Martin Corp. are teaming to compete for the United States Air Force’s Long-Range Strike Bomber program, with Boeing acting as the prime contractor and Lockheed Martin as the primary teammate.

LPKF Laser & Electronics has announced the launch of a new educational video series, Ask LPKF, which will feature user-submitted queries about LPKF products and technologies.

Molex Inc. will present leading edge high-speed, high-density solutions at the 39th European Conference on Optical Communication (ECOC 2013) being held September 22-26 at the ICC London ExCEL, England.  ECOC is the largest European optical communications event for the fiber optic industry.