Articles Tagged with ''materials''

DuPont MCM introduces new low cost conductive inks for printed electronics

DuPont Microcircuit Materials (MCM) is introducing a new series of screen printed conductive ink materials for the printed electronics market, designed to offset the rising cost of silver. Utilizing proprietary technology and under typical processing conditions used for many printed electronic applications, DuPont PE8XX series conductive inks can provide low resistivity with 20 percent or more potential cost savings for manufacturers.


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Rogers to showcase high performance printed circuit board materials at EuMW 2012

Rogers Corp. will be exhibiting at the 2012 European Microwave Week on October 29 through the 31st, at the Amsterdam RAI Exhibition and Convention Centre (Amsterdam, The Netherlands). European Microwave Week (www.eumweek.com) consists of three major conferences — the European Microwave Conference (EuMC), the European Microwave Integrated Circuits Conference (EuMIC), and the European Radar Conference (EuRAD), as well as a three day exhibition from October 29-31, 2012.


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Rogers to highlight trio of antenna circuit materials at Mobile Antenna Systems 2012

Rogers Corp. will be displaying three of its leading high-performance circuit materials for mobile and fixed-site antennas at the upcoming Mobile Antenna Systems 2012 conference and exhibition. This key event for designers and specifiers of antennas for a wide range of fixed and mobile applications is scheduled for September 18-19, 2012 at the Hyatt Denver Tech Center (Denver, CO).


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Rogers to highlight material solutions spanning RF to digital at the 2012 IPC Midwest Show

Rogers Corp. will have a strong presence at the upcoming IPC Midwest Exhibition and Conference, both on the show floor and as part of the technical conference. This key industry event is scheduled for August 22-23 at the Renaissance Schaumburg Convention Center Hotel in Schaumburg, IL, the IPC Midwest Exhibition and Conference (www.ipcmidwestshow.org) is for electronic circuit assembly and printed-circuit-board (PCB) manufacturing professionals.


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LTCC materials system from Ferro Electronic Materials helps reduce power use

Ferro Electronic Materials expands its low temperature co-fired ceramic (LTCC) portfolio, which includes industry-leading A6M and A6S,with a new line of cost-effective matched materials that offers better performance over a greater range of frequenciesand easier manufacturability than market alternatives. The company will introduce its new L8LTCC product line in booth 9-212 at SMT Hybrid Packaging 2012, to be held May 8-10 in Nuremberg, Germany.


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