Infineon Technologies AG has signed a Memorandum of Understanding (MoU) with the Hindustan Semiconductor Manufacturing Corp. (HSMC) to license its leading-edge 130 nm CMOS process technology. HSMC is a newly established semiconductor company, while Infineon has been active in the Indian semiconductor market for 10 years.

This MoU will help both companies build a foundation for the production of integrated circuits for mobile phones, automotives and ID cards.

Under the terms of the MoU, Infineon will license its 130 nm CMOS basic process technology, along with its process technologies for radio frequency, embedded flash for chip card applications and embedded flash for automotive applications to HSMC. The company will offer expertise and advice for the technology transfer, and setup of the HSMC Fab and also license its fully qualified and silicon/product-proven design libraries. This will enable fast ramp-up of product development for HSMC.

“We look forward to our cooperation with HSMC,” said Wolfgang Ziebart, CEO of Infineon. “With this cooperation, we position ourselves as a reliable partner for the prosperous Indian semiconductor market.

By bringing our process technology to the Indian market, we help build the foundation for the production of integrated circuits for the Indian market in the years to come.

With our strategic direction towards the segment’s energy efficiency, connectivity and security, we are a perfect fit for the Indian market.”

Deven Verma, chairman of the board of HSMC, replied, “This initiative will lead India to become a destination of choice for the future of manufacturing hi-tech products. While India’s GDP is around nine percent, the development of semiconductor manufacturing will help catapult the GDP to approximately 10 to 11 percent per year.”