Blueshift introduces PhaseBlue® 1500, the first product in its Series Circuit Materials (SCM) line at this year’s (2025) European Microwave Show. These latest laminates are engineered with a proprietary nanoporous polyimide aerogel core composed of 85 percent air and 15 percent polyimide, enabling an unmatched combination of light weight, flexibility and high-frequency performance.
 
 As a U.S. made and sustainably compliant material that meets modern environmental standards (formulated without intentionally added per- and polyfluoroalkyl substances), PhaseBlue® addresses growing regulatory and environmental concerns while delivering a next-generation alternative to PTFE-based substrates.
 
 PhaseBlue® SCM offers a dielectric constant (Dk) of 1.3 to 1.5 at 1 GHz and an ultra-low dissipation factor (Df) of < 0.001 at 1 GHz. Unlike conventional perfluorinated substrates, PhaseBlue® maintains stable dielectric performance across a wide frequency range (1 to 10 GHz) without exhibiting the ‘dielectric knee’ that compromises signal reliability under high temperatures.
 
 With a glass transition temperature (Tg) of 305 °C and decomposition temperature of 530 °C, PhaseBlue® materials deliver superior thermal stability during soldering, processing and long-term operation — far beyond the survivability of PTFE-based systems.
 
 PhaseBlue® is up to 80 percent lighter than conventional laminates with a density of 0.27 to 0.45 g/cm³. Its thin profile, available in dielectric thicknesses from 0.0065 to 0.030 in. (165 to 750 µm), provides engineers with flexible, formable solutions ideal for 3D structures, conformal antennas, phased arrays, radomes, CubeSats, UAV systems and high speed aerospace communications.
 
 Importantly, PhaseBlue® integrates with existing FR-4 PCB processes (DES, drilling, etchback), allowing engineers to adopt it without special equipment or costly process changes.
 
 Tim Burbey, president at Blueshift, commented, “The European Microwave Show is the ideal venue to showcase PhaseBlue® 1500. Engineers today face complex challenges in RF design, balancing performance, weight and regulatory pressures. Our PhaseBlue solution offers a breakthrough: lightweight, thermally robust and easy to integrate into existing PCB manufacturing. With these qualities, engineers can expand design freedom while maintaining signal integrity, reliability and long-term durability.”
 
 Burbey added, “PhaseBlue is proven, having already been applied across multi-layer antenna boards, CubeSats, UAV communications and advanced aerospace and defense platforms, with results highlighting reliability under extreme, and demanding conditions.”