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Soitec POI

Soitec Announces POI Substrates Business Agreement with Qualcomm Technologies for 5G RF filters

Piezoelectric-on-insulator process going into production

Soitec (Euronext Paris) announced a business agreement with Qualcomm Technologies, Inc. on the supply of piezoelectric-on-insulator (POI) engineered substrates for 4G and 5G RF filters. Soitec’s piezoelectric-on-insulator substrate brings strong value proposition to smartphones’ 5G filters for mass markets.


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Hensoldt Leads New Radar Consortium

Sensor system supplier HENSOLDT has been awarded a contract by Airbus Defence and Space to develop and produce a new active electronic scanning array (AESA) radar for the German and Spanish Eurofighter fleets.


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r&S-5-18-20

Rohde & Schwarz First to Equip Test Instruments with New 1.35 mm E-Band Coaxial Connector

Rohde & Schwarz has implemented a new 90 GHz connector, called the E connector, in two thermal power sensors, the R&S NRP90T and R&S NRP90TN. With a precise metric fine thread, a reliable pin-gap and an integrated groove for optional push-pull locking, the 1.35 mm E connector fills a gap between the well-established 1.85 mm connector (the V-Band connector) and the 1 mm connector (the W-Band connector).


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IMAGE GALLERIES

EuMW 2017

Nuremberg, Germany

EuMW 2014

Rome, Italy
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