Check out what's in store for IMS2025 in this show preview covering products expected to be on the expo floor.
Aaronia AG
Aaronia AG will be presenting the latest solutions for high frequency measurement for three days in Hall B, Booth 1459. With the RTSA of the SPECTRAN® V6 XPR series, Aaronia AG is presenting one of the world's most powerful USB-based analyzer series at IMS 2025. Equipped with sweep speeds of > 3 THz/s and state-of-the-art waveguide technology, high frequency and rapidly changing signals in the microwave range can be reliably analyzed and evaluated. The SPECTRAN V6 PLUS XPR 250XB-WR12, for example, offers 10 dB NF at 77 GHz. This makes it the perfect choice for radar measurements, for example in the automotive sector (76 to 81 GHz). In addition, the V6 XPR series is an attractively priced solution. Thanks to the waveguide connection, you can connect your own amplifier and splitter systems to the RTSA from Aaronia AG according to your requirements. Aaronia thus provides affordable solutions for such applications.
AR
As part of the **AMETEK CTS** family, AR is showcasing cutting-edge solutions that set the standard for performance in defense, EMC testing and wireless communications applications Visitors to the AR booth can experience a live demonstration of their latest microwave amplifier system, engineered to deliver the power, precision and rugged reliability demanded by mission-critical applications. Designed and manufactured in the USA, AR amplifiers are known around the world for pushing performance boundaries while offering unmatched quality and support. Also featured at the show is the new Teseq NSG 4070D, a versatile and compact RF conducted immunity test generator designed for fast, flexible compliance testing. As part of the broader AMETEK CTS portfolio, Teseq products complement AR's amplifier systems with industry-trusted immunity solutions.
Amphenol Printed Circuits
Amphenol Printed Circuits (APC) will be offering a small but impressive sample of its design, manufacturing and test capabilities in RF printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at IMS. Visitors to booth #1126 in the Moscone Center can see examples of PCBs for commercial and military applications, including high speed-digital (HSD) circuits to 25 Gbps, RF/microwave planar antenna arrays and beamforming networks to 40 GHz and beyond and hybrid combinations of analog, digital and RF/microwave assemblies precision designed, assembled and tested in APC’s facilities in Nashua, N.H., Mesa Ariz., and Nogales Mexico, delivering full turnkey assembles.
Antennex
Antennex, at Booth #2129, debuts a disruptive new functionality. Unlike conventional techniques that rely on cumbersome setups including liquid nitrogen or radiated noise sources with careful calibration, Antennex’s method is fully OTA, self-contained, and operator-friendly. The demonstration at IMS shows a complete noise figure characterization performed live, in a realistic setup. The technology was developed in close collaboration with leading industry partners and is currently the subject of multiple standardization initiatives.
Antenom
Antenom Antenna Technologies will present its full portfolio of block-based Anten’it antenna and microwave products, high-power defense antennas and an early preview of its upcoming RNDMarketplace platform at IMS. Visit Booth #1668 to explore the latest innovations from one of the most dynamic RF and microwave companies in the field. Antenom’s Anten’it® product line is the only modular, block-based training and prototyping system designed for hands-on education, rapid R&D and custom antenna creation. It enables engineers, researchers and students to build, test and modify antennas and microwave components within minutes.
Ansys
Visit Ansys’ booth to explore the latest in RF and microwave systems, chip thermal management and microwave component simulation and optimization. See live demos and presentations from customers, partners and Ansys experts at booth #1543 and be sure to catch their in-booth theater sessions, packed with expert talks and customer stories.
ATEK Midas
IMS attendees can visit ATEK’s booth #1147 to learn about the company’s catalog and custom offerings for wired, wireless, optical communication and sensor applications. Technical experts will be available to answer your questions on our key MMICs such as tunable filters / amplifiers / control devices, SiGe / RF CMOS / FD-SOI / BCD / GaAs / GaN Custom ASICs and IMAs / RF connectorized modules.
Bird RF
Stop by Bird RF's booth #568 to experience live demos of their newest solutions, including:
- 4480A Digital Wattmeter – A next-generation RF power meter that requires no plug-in elements and delivers real-time measurements across 2 MHz to 1 GHz. Ideal for both CW and digital signals, it’s built for speed, accuracy, and convenience in the field or lab.
- GH-60 GenHawk Vector Signal Generator – A powerful, handheld generator covering 100 MHz to 6 GHz (upgradeable to 300 kHz to 6.5 GHz) with full support for AM/FM, pulse, GSM, LTE, 5G NR, and more. Built for field professionals who need precise signal generation on the go. Whether you're testing, validating, or troubleshooting RF systems, Bird’s tools help you work smarter—without the complexity
Cadence
Visit Cadence in Booth 1843 at IMS. Stop by to see software demonstrations, talk with Cadence experts and catch a glimpse of Candence latest design and analysis platforms, and workflows. Discover Cadence's complete RF/microwave full design flow, from concept to manufacturing, addressing the design and analysis of MMICs, RFICs and modules for IC packaging, power amplifiers, RF PCBs and 5G and radar systems. Cadence RF solutions, including Virtuoso Heterogeneous Integration for RF Solution, the new Virtuoso Studio RF platform, Microwave Office software, Visual System Simulator, Clarity 3D Solver, Celsius Studio Thermal Solver and EMX 3D Planar Solver, maximize advanced-node process benefits and streamline advanced IC package and module design implementation, verification and multiphysics analysis to speed development of RF/mmWave components and systems.
Elite RF
Elite RF will showcase its latest innovation, a C-Band amplifier system delivering 5 kW peak power at IMS 2025, June 17-19 in San Francisco, Calif, in booth 1364. The amplifier, engineered to meet the demands of modern C-Band high RF power applications, is built for customers in defense, aerospace, weather radar and commercial applications who require high RF power, gain, field replaceable modules and rugged reliability. Built with advanced GaN-based architecture, the system offers excellent linearity, pulse capability and thermal management in a rack-mountable design. It also features intuitive control interfaces for simplified integration into both new and existing platforms. Elite RF’s portfolio will be on display throughout IMS 2025. Engineers and attendees are invited to stop by the booth to view the new 5 kW system and discuss their amplifier requirements.
HAROGIC Technologies
HAROGIC Technologies invites engineers, researchers and industry partners to visit booth 768 to see their cutting-edge spectrum analyzer solutions designed for critical applications in test and measurement, 5G/6G and telecommunications R&D. Attendees can see live demos of the latest IP68 rugged spectrum analyzers with enhanced rugged design, dynamic range and real-time analysis capabilities. Discuss your technical challenges with HAROGIC’s RF engineering team for customized test solutions in test and measurement, software defined radio and spectrum monitoring while visiting their booth.
Indium Corporation
Indium Corporation will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at IMS2025. Among its featured products, Indium Corporation will showcase:
- AuLTRA® 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA® 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA® product line is also available in 78Au/22Sn and 79Au/21Sn compositions.
- AuLTRA® Die-Attach Preforms offer the new gold standard — the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include: highly accurate thickness control, precise edge quality, optimized cleanliness, default waffle pack method and available for gold-based alloys.
Additionally, Indium Corporation will feature their gold-based die-attach solutions.
Insulated Wire
Insulated Wire (IW) will be showing a range of their high performance coaxial and microwave cables, cable assemblies and bulk cables at IMS2025. IW products meet the requirements of a wide range of applications from aerospace to telecommunications. Of note at the exhibition will be the 1 mm cable assemblies using their series of precision low loss coaxial cables, engineered for superior performance in high frequency applications and operating seamlessly up to 110 GHz. This series stands out for its advanced material and design choices, making it a premier solution for applications requiring high precision and minimal signal loss. Visitors can collect three new product brochures including the High Power Microwave Products catalogue, the Re-Flex™ cable catalogue and the latest Short Form catalogue.
JFW Industries, Inc.
Visit JFW at booth #827 and find solutions to your requirements from the specialists in attenuation and RF switching. Whether you're designing a test lab or upgrading existing systems, their expert staff including, Simon Watkins, vice president of sales, Brett Chermansky, vice president of engineering and Steve Leonard, U.S. sales engineer, will be on hand at IMS2025 to offer valuable insights into selecting the right components for your RF testing needs.
Junkosha
Junkosha's booth #665 will showcase the company's new MWX161 cabling solution, an ideal cable for connecting with multiport vector network analyzers (VNAs) where space is at a premium. Alongside the MWX161, Junkosha will also announce the expansion of its Cable Assembly Designer; a product selection tool for Junkosha® Microwave/mmWave coaxial cable assemblies that are customizable to a host of test and measurement, space and defense applications and high frequency needs within mobile communication technology.
Junkosha’s MWX161 interconnect has excellent phase and amplitude stability over flexure and temperature change, is available with skew matching within 1 psec and performs up to 67 GHz. It is a highly flexible armored cable, so even when connecting to dozens of ports on a multiport VNA, the bending force generated when the cable is bent does not transfer to the device under test (DUT), allowing for stable measurements. Typical use cases, in addition to multiport VNAs, include testing signal integrity on printed circuit boards (PCBs); narrow pitch RF matrix switchers that route RF signals between multiple inputs and multiple outputs; and connector DUT boards which serve as an interface circuit between the automatic test equipment and the DUT. To add to its ease of connection, a torque driver is now provided to mount the interconnect on to the narrow pitch connector arrangement board or on to the VNA’s side.
Keysight Technologies
At booth #743, Keysight Technologies’ RF and microwave experts will showcase solutions designed to drive spectrum innovations to optimize 5G networks and pioneer 6G technologies. With an end-to-end portfolio of product development solutions that quickly solve design, emulation and test challenges, Keysight is reducing risk and speeding time-to-market for satellite, IoT networks, massive MIMO antennas and 6G technology.
Keysight will present the following demos that are accelerating RF and microwave innovation:
- Next-Generation RF Circuit Simulation and Optimization – RF Circuit Simulation Professional provides a unified, cross-platform environment that streamlines the entire design workflow, empowering engineers to comprehensively characterize multi-domain performance and achieve first-pass success through seamless co-simulation and optimization across different design platforms, mitigating costly and time-consuming redesign cycles.
- 3D Heterogeneous Integration (3DHI) RF Module Integration and Simulation – Advanced Design System (ADS) 2025 enables drag-and-drop convenience for assembling silicon RFIC, III-V MMIC, packaging and PCB into a 3DHI RF module. It replaces these four disconnected design flows with one efficient multi-technology workflow
- D-Band RFIC Analysis features record-breaking high-power full-duplex D-band links developed by NOKIA Bell Labs. This non-over-the-air (OTA) demo showcases IQNC technology at D-band, which effectively eliminates additive noise in receiver hardware, including CCD, for unmatched signal quality.
- Basic Network Analysis to Complex Characterizations (PNA-X Pro) showcases the versatility of Keysight’s VNA instrument portfolio to meet diverse customer needs, including portable VNA models, high-performance benchtop PNAX-Pro models and production form factor models.
- Phase Noise Test demonstrates advanced phase noise testing techniques that deliver the sensitivity and frequency coverage needed for today’s high-performance RF and mmWave systems.
MACOM
At booth #943, MACOM will feature 16 hands-on technology demonstrations showcasing real-time performance and results, including many of the company’s new products for EW, radar and satcom applications. Demonstrations will include a high performance wideband low noise amplifier (LNA) and power amplifier (PA); X-Band PA pallet and front-end module; C-Band linearizers and PAs; Q-Band linearizer; Ka-Band and Ku-Band PAs; E-Band up-converter and LNA; 2 to 18 GHz solutions including an integrated switched filter bank; transmit/receive module and time delay unit; switches and limiters as well as a display of a wide variety of RF, microwave and mmWave products.
Booth #1143 will present MACOM’s Foundry Services, highlighting its deep expertise in GaN and GaAs process technologies. The company’s foundry capabilities support the entire product development lifecycle, from design assistance and scalable device models to production-ready processes and quality testing. MACOM’s foundry team will be available to discuss how its services can help customers move from initial development through high volume manufacturing with proven high first-pass design success and process reliability.
MCV Microwave
Meet MCV Microwave live demonstrations and new products showcase in booth #965.
Highlights at MCV Booth #965 include: Live demonstrations of ultra-narrowed band filters with cable assembly (excellent matching), GPS cavity notch filter and L1/L2 ceramic duplexer for LTE signal suppression, low band / mid band / high band low PIM diplexers with harmonic suppression and dual notch cable filters. Their product portfolio includes made in America ceramic monoblock, ceramic waveguide and planar filters; broadband cavity combiners; ultra-narrowband cavity filters; high power / high performance cable assemblies with power dividers and LNA; thin film on high K ceramic substrates; lumped element filters and integrated assemblies; and passive components.
Mini-Circuits
Mini-Circuits’ team members and subject matter experts will be on-site at booth #1351, exhibiting recent innovations Mini-Circuits’ rapidly evolving portfolio of products and technologies. Highlights will include a wide range of high-frequency amplifiers and modules supporting mmWave applications and test sets from DC to 110 GHz; GaAs MMIC power amplifiers capable of PSAT up to 10 W and new miniaturized component packaging as small as 1.5 x 1.5 mm; micro-ceramic™ component innovations, including high-rejection filters and Mini-Circuits’ first offering of AEC-Q200 qualified parts for automotive applications; new ISM RF and microwave energy solutions, including a low-frequency platform (3 to 500 MHz), high-power combiners up to 16 kW and more; recent portable test equipment releases including peak and average power sensors, dual-channel signal generators and MEMS switches; connectorized passives and test accessories, including a new line of precision phase-stable flex cables and waveguide to coaxial adapters and a showcase of Mini-Circuits’ broad line of RF filters and diplexers comprising nine unique technologies designed and built in-house.
Mixed Signal Devices
Mixed Signal Devices’ latest timing portfolio includes the MS1130 1 GHz and the MS1150 2 GHz oscillator — each engineered for next-generation performance. These devices deliver femtosecond-level jitter, ±20 ppm thermal stability, and programmable configuration in compact CMOS packages. The MS1130 is optimized for high frequency applications such as 800G networking and AI compute fabrics, while the MS1150 is purpose-built for ultra-low jitter system clocks and timing cleanup in complex architectures. The MS1130, MS1150, MS1500 and MS1510 clocks are sampling now and will be showcased at IMS.
mmTron, Inc.
mmTron, Inc. will showcase 16 new and innovative MMICs at IMS. Attendees can visit mmTron’s booth #2252 to learn about the products launched since last year’s IMS, each designed to advance the performance of satellite communications (Satcom), fixed wireless access, aerospace, defense and instrumentation.
mmTron’s expanded catalog includes a comprehensive array of mmWave front-end modules, power amplifiers, low noise amplifiers, wideband distributed amplifiers, LO drivers, mixers and switches. The portfolio demonstrates mmTron’s commitment to providing system designers the industry-leading linearity, output power and efficiency — the performance required for increasing data rates over extended communication distances.
Mtron
Attendees can visit Mtron's booth #1231 to explore their latest innovations and discover high-precision RF solutions, filters, crystal oscillators, VCXOs, TCXOs and OCXOs; See a live demonstration: experience real-time performance of their newest low phase noise OCXO; meet the experts and get insights into emerging trends, technical challenges and custom solutions tailored to your needs; and learn how Mtron’s advanced technologies can support your toughest performance and reliability demands.
pSemi
pSemi will release its first broad-market products based on the UltraCMOS+ platform at the IMS. Attendees can stop by booth #443 to see live demonstrations and learn more about their RF solutions. Advancing the performance of legacy and patented UltraCMOS® technology, UltraCMOS+ enables pSemi to offer the next generation of monolithic integration with vast improvements in power handling, linearity, isolation, RON, COFF, integrated intelligence and ultimately portfolio expansion.
Quantic Electronics
Join Quantic Electronics at booth #1251 to explore their comprehensive portfolio of RF and microwave components for your toughest design challenges, including:
- Gap Capacitor: Introducing the new XG Series – low loss, high Q and ultra-high self-resonant frequency
- Custom RF Filters: Fast-turn, custom and cross-reference multi- and single-line filters
- Frequency Timing & Control Solutions: Ultra-low phase noise solutions, including the new Whisper Series phase locked DROs from Quantic MWD
- Custom & COTS Solutions: State-of-the-art DC to 70 GHz RFMW components, modules and subsystems
- Embedded Resistor Technology: Advanced thin-film technology, including OhmegaPly, TCR and TCR-EHF
- Modular RF Design Platform: Patented modular design platform for quick-turn prototyping and production
- New RF Layout Tool: An interactive design environment for part selection and layout of signal chains designed with X-MWblocks.
Quantic Eulex
Quantic Eulex will showcase its XG Series Gap Capacitors at IMS. The XG Series introduces an array of breakthrough features designed to elevate high-frequency circuit performance, providing a tenfold increase in capacitance compared to traditional solutions while maintaining Class 1 dielectric stability and high Q factors. They exhibit inherently ultra-low ESR and ESL, allowing for broader bandwidths and reduced signal loss — critical for RF and microwave systems that demand precision and reliability.

Quantic MWD/Quantic Wenzel
At the Quantic Wenzel and Quantic MWD booth, #1251, they're demonstrating the electrical performance of their ultra-low phase noise frequency control and timing products, including the all new Whisper Series Phase Locked DROs. RF engineers will be available during regular exhibit hours to showcase and discuss with attendees. The Whisper Series Phase Locked Dielectric Resonator Oscillators (PLDROS) are for mission-critical frequency control and timing applications. Designed to meet and exceed stringent system requirements, Whisper Series PLDROs deliver exceptional frequency stability and low phase noise performance, even in the harshest environmental conditions. Available in X-Band and Ku-Band frequencies ranging from 8 to 18 GHz, these oscillators can be fully customized with phase locked loops and tuning for enhanced performance. Key Specifications include low phase noise of -110 dBc/Hz at the 10 kHz offset and -105 dBc/Hz at the 1 kHz offset, frequency range from 8 to 18 GHz, operating temperature of 0ºC to 50ºC (standard), external reference pairing options with Quantic Wenzel OCXOs and space qualified version are available. Applications include satellite communications, radar systems, base stations, portable transceivers and test equipment.
Quantic PMI
Quantic PMI will be showcasing their latest advancements in RF and microwave components and integrated assemblies that includes solid-state power amplifiers, high power limiters, high speed switch and switch matrix solutions. Plan a visit to booth #1251 to learn about Quantic PMI‘s wide range of offerings, including active and passive filters, switches and low noise amplifiers, frequency control and timing solutions and modular RF and microwave building blocks.
Reactel
Reactel will feature their full line of application-specific filters, multiplexers and multifunction assemblies up to 67 GHz. Reactel products are used by top-tier military contractors such as Lockheed Martin, L3Harris Technologies, BAE Systems and Northrop Grumman in ground, airborne and space applications. As an AS9100-accredited company, Reactel has earned the trust of these and many other suppliers in the defense, commercial, space and industrial markets. Stop by booth 632 to speak with the Reactel team, including Ray Hashemi, engineering manager and Jim Assurian, business development engineer and author of the well-read Maryland Filter Guy blog. While visiting with the Reactel team, pick up the new Short Form Catalog for an overview of the extensive filter portfolio. Bandpass, lowpass, highpass and notch filters are available in an array of topologies such as tubular, LC, cavity, waveguide, ceramic and suspended substrate. Application specific multiplexer and multifunction assemblies are available as well.
Remcom
Remcom has a new version of Wireless InSite® 3D Wireless Prediction Software with advanced capabilities including time-based mobility, lunar propagation modeling and wideband ray-tracing with S-parameter outputs. The new release (Release 4.0) expands upon Remcom’s longstanding commitment to technical precision, supporting rigorous simulation of dynamic and complex RF environments, including on-body propagation and NASA Artemis missions. Wireless InSite 4.0 introduces a robust mobility framework that accurately models the movement of transceivers and objects within a user-defined scene. Mobile platforms now enable precise evaluation of dynamic scenarios where mounted antennas on scatterers like vehicles and humans affect channel conditions. Time-based outputs, rendered as plots or animations, provide detailed insights into multipath and fading, received power, SINR and data throughput across time as RF systems and vehicle platforms move through a scene. A new Results Browser and Viewer provide multi-result access and time-sequenced visualization, allowing engineers to focus on dynamic behaviors with clarity.
Richardson RFPD
Highlights at Richardson RFPD's booth #243 include live demos of the RadioOxygen, a dual 26.5 GHz phase coherent signal source and BytePipe, a flexible and powerful embedded SDR SoM. New innovative products and component solutions showcased by top manufacturers for the following featured applications: aerospace and defense; cellular infrastructure; industrial, scientific and medical; interconnect; satcom; software defined radio; and test and measurement. Featured suppliers include Analog Devices, Guerrilla RF, Kyocera AVX, MACOM, Microchip, NXP, pSemi, Skyworks, Teledyne Defense Electronics, UMS, TTM Technologies and more.
Rohde & Schwarz/Kyocera
Crucial to the demonstration at the Kyocera booth (1651) is the R&S ATS1800M 5G NR multi-directional mmWave test chamber from Rohde & Schwarz, designed for over-the-air (OTA) testing with an exceptionally small footprint.
The demonstration will focus on mobile communications in the 5G FR2, n257 band. Mobile communications in this frequency range experience a high path loss, which can be solved using beamforming antenna arrays. In contrast to traditional antennas, FR2 antennas typically use phased arrays with a high number of individual antenna elements. Kyocera has
developed a novel phased array antenna module (PAAM) featuring 384 dual polarization elements, which can create up to eight simultaneous beams in different directions at different frequencies. With this design, the PAAM can be used in site installations allowing multiple operators to run networks on different frequency bands. In protection applications, PAAM technology can be adapted to sense threats, perform surveillance and communicate simultaneously. However, all of these antenna elements must work together perfectly to form an RF beam with the desired characteristics. Rohde & Schwarz offers a patented approach for OTA testing of such a complex antenna array in a fully shielded environment, which helps engineers verify the correct beam pattern and supports the process of minimizing sidelobes.
The R&S ATS1800M is a unique solution that features four feed antennas and CATR reflectors, each with a 30 cm quiet zone (QZ). At IMS2025, the Kyocera PAAM device under test (DUT) is placed on a rugged 3D positioner in the center, where all four QZs overlap, coming from multiple directions. This allows Kyocera’s engineers to address a variety of different tests, including the simultaneous reception of RF beams from four different directions, as will be shown at IMS2025. Thanks to the vertical CATR design patented by Rohde & Schwarz, this setup takes up a fairly small footprint in the lab compared to other OTA solutions.
Visitors can find Rohde & Schwarz in booth #1443, where updates for the tried and tested R&S FSWP phase noise analyzer as well as the latest vector network analyzer R&S ZNB3000 will be on display. Another highlight at the company’s booth is the new R&S ZNB3000 vector network analyzer, which is optimized for high volume production and short ramp-up times thanks to industry-leading measurement speed and reliability. Its scalable design allows for rapid upscaling and easy adaptation to application specific requirements.
Rohde & Schwarz continues to expand its solution partner relationships. At IMS2025, the company lets exhibition attendees experience RF design workflows in a fun way with the IMS workflow passport challenge. It involves stops at multiple industry partners and a chance to win prizes.
Rogers Corporation
At Booth #2243, Rogers will be showcasing their newest product solutions, including RO4830™ Plus for automotive radar applications and RT/duroid® 5280LZ for aerospace and defense applications. These recently launched materials are designed to meet the evolving demands of high performance systems.
Smiths Interconnect
In booth #343, Smiths Interconnect will display a broad range of microwave and RF components (attenuators, terminations, power dividers, filters, circulators/isolators), optical transceivers, subsystems, cables and connectors that ensure optimal performance, durability and safety in demanding environments.
Demonstrations include LightABLE-RF™ and SpaceABLE-RF™ RF-over-Fiber (RFoF) capability utilizing an 850 nm VCSEL over multimode fiber enabling new lows in SWaP-C; Thermopad® temperature variable attenuators with patented technology replacing costly, complex active temperature compensation alternatives; Mini-Lock ultra-high reliability RF cable assembly with patent pending technology operating up to 110 GHz; and EZiCoax, a single-piece, spring-loaded SMP connector operating up to 40 GHz.
Spectrum Control
Spectrum Control (booth #927) will be unveiling its low-jitter, high frequency signal source system-in-package (SiP) and 18 to 40 GHz mmWave block up-converter SiP at IMS2025. The stable, high frequency signal source SiP is a complete system of clocks with up to four buffered (or divided) high-frequency clocks paired with synchronous system reference signals for JESD interfaces, as well as one FPGA signal. Its small footprint (0.75 x 1.75 in.) allows board size to be shrunk and speeds development and manufacturing. The mmWave block up-converter up-converts standard 2 to18 GHz bands into mmWave signals (18 to 40 GHz) in a 30 mm2 BGA package. It can be paired with Spectrum Control’s 18 to 40 GHz block down-converter SiP to adapt a 2 to 18 GHz direct sampling system to support mmWave frequencies.
SV Microwave
SV Microwave is exhibiting at IMS2025 in the Amphenol Corrido at booth 1127. SV Microwave's team of knowledgeable engineers will be on hand to answer all questions and guide you through their latest product offerings, such as the NanoRF VITA 67.3 Connector System, BMB RF adapters, torque resistant edge launch connectors and more. Make sure to stop by the joint Amphenol happy hour on Tuesday, June 17, from 3-5 PM PDT. SV Microwave will be hosting with Amphenol Printed Circuits, Micro-Coax, Q Microwave and Times Microwave Systems at booths 1126, 1127 and 1131.
Tabor Electronics
Attendees are invited to stop by Tabor Electronics' booth, #2128, to explore four live demo experiences. See how engineers use Tabor tech to drive real-world innovation:
- FR3 Software-Defined Radio for advanced base station and 6G development
- AI Signal Identification at 10GHz using LSX and Proteus (Capella setup)
- Covert Communications with real-time direction-finding
- Reservoir Computing for low-power AI applications.
TagoreTech
TagoreTech will be exhibiting at IMS2025 in booth #332. TagoreTech will showcase its latest innovations, including GaAs low noise amplifiers (LNAs), resilient LNAs, second-generation GaN-based RF switches, MCM switch-LNA modules and GaN power amplifier devices.
WIN Semiconductors
In booth# 559, WIN Semiconductors features its new NP12-1B, a 0.12 μm gate-length depletion-mode (D-mode) GaN high electron mobility transistor (HEMT) technology on Silicon Carbide (SiC) substrates. Engineered for demanding high-power applications across K-Band to V-Band frequencies, NP12-1B delivers industry leading high power front end solutions with exceptional linearity, ruggedness and reliability for next-generation RF and microwave systems.