Rogers Corporation announced that Technical Marketing Manager, John Coonrod, will present Thermal Management for High Frequency Printed Circuit Boards from 11:45 – 12:00 p.m. on Tuesday, June 8 and Stripline Circuitry for Millimeter-Wave and Very High Speed Digital from 11:15 – 11:30 p.m. on Wednesday, June 9 in the MicroApps Theater at the International Microwave Symposium (IMS) in Atlanta. 

In addition, Rogers will be showcasing its latest 5G and autonomous vehicle materials and other products in booth #1621 during IMS, the industry’s largest RF and microwave show, which takes place from June 7 to 10. These products include XtremeSpeed™ RO1200™ laminates and bondplies, RT/duroid® 6035HTC laminates, as well as recently launched SpeedWave™ 300P ultra-low loss prepreg.

XtremeSpeed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. These circuit materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications. With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 at 10 GHz, XtremeSpeed RO1200 materials provide outstanding signal integrity, reduced signal skew and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE and a halogen free UL 94 V-0 rating, these materials are well suited for the most demanding high layer count applications.

RT/duroid 6035HTC laminates feature a relative dielectric constant of 3.5 at 10 GHz, making them suitable for a wide range of circuits, including amplifiers, couplers, filters and power combiners/dividers employed in avionic and other military and hi-reliability systems. The laminates incorporate a unique filler material to achieve superior heat-transfer characteristics compared to other high frequency circuit materials with similar dielectric constant. With outstanding thermal conductivity of 1.44 W/mK as well as low loss, with a loss tangent of 0.0013 at 10 GHz, for excellent high frequency performance, this combination of high thermal conductivity and low dielectric loss translates into improved amplifier performance.

SpeedWave 300P prepreg provides excellent thermal reliability for the most demanding high layer count designs requiring multiple sequential laminations. It also delivers superior fill and flow capability around heavy copper features, a low z-axis expansion for plated through-hole reliability and is CAF resistant. This UL 94 V-0 rated material is compatible with modified FR-4 fabrication processes and lead-free PCB assembly processing and is ideal for 5G mmWave, high resolution 77 GHz automotive radar, aerospace and defense and high speed digital designs.