In response to the continuing challenges caused by the global pandemic, the organizers of EDI CON CHINA have decided to change the program for 2021 to ensure timely delivery of technical conference material to engineers across the country. Instead of a large in-person event this year, EDI CON CHINA 2021 will occur as EDI CON ACROSS CHINA 2021, which will include a virtual event paired with localized in-person conferences in two cities. EDI CON CHINA will return to its regular format, with a full in-person conference and exhibition, in Beijing at the CNCC April 26-27, 2022 for its hallmark event.


The EDI CON ACROSS CHINA virtual conference will take place May 12-13 with two days of online sessions, workshops and keynotes from international speakers covering topics on 5G, Wi-Fi, IoT, satellite, radar and automotive (all talks will be given in Chinese). Then, EDI CON ACROSS CHINA will launch a series of in-person localized conferences with stops in Shanghai (July 22-23) and Shenzhen (December 9-10), with planned tracks on semiconductor applications and design, 5G, radar and automotive. The Shanghai and Shenzhen events will also include an exhibition with tabletop displays.


The May virtual conference tracks include two full days of educational talks (given in Chinese). Day one will cover 5G and IoT topics and day two will cover satellite/radar/automotive topics. There are special keynotes including the transition from 5G technologies to 6G by Dr. Amitava Ghosh, Nokia Fellow and head of Radio Interface Group at Nokia Bell Labs in the U.S., and the Internet-of-Intelligent-Things in the Era of 6G by Dr. Wai Chen, chief scientist at China Mobile Research Institute in Beijing on day one. These talks will give a look into the future of communications and connectivity addressing some of the challenges to be overcome as we move into the next generation of mobile communications. 


Day two keynotes include How Microwave Technologies are Changing Vehicles with UWB Technology by Lars Reger, executive vice president and CTO at NXP Semiconductors plus a closing keynote looking into the future with Drone Based Mobile Quantum Links by Professor Zenda Xie, School of Electronic Science and Engineering, Nanjing University. There are many more technical sessions from leading companies such as host sponsor Keysight, diamond sponsor Rohde & Schwarz, silver sponsors Cadence, GBiTest, Comsol and Syntronic. 


Please join us online May 12-13. Registration will be open soon! Please note that all talks for EDI CON CHINA Online will be presented in Chinese.


More information about EDI CON ACROSS CHINA will be released and available at