Indium Corporation has expanded its portfolio of precision preforms with an ultra-thin AuSn preform designed for semiconductor laser applications, where thermal management has become a challenge.

Indium Corporation’s AuLTRA® ThInFORMS™ are 0.00035-thick (0.00889mm- or 8.89μm-) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS™ help combat common issues, such as: 
•    Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
•    Poor thermal transfer—the ultra-thin 0.00035” preform reduces bond-line thickness, thus improving thermal transfer and increasing the longevity and performance of the device.