Infineon Technologies announced cumulative shipments of 5 billion bulk CMOS RF switches since it began volume production in 2008, with annual shipments now well above 1 billion.

Infineon is introducing its next-generation bulk CMOS switches: new antenna swapping devices BGSX22G5A10 and BGSX33MA16. Samples are available now, with volume production scheduled to begin in late summer.

According to Infineon, bulk CMOS does not require extra oxide layers or different materials during wafer processing, which reduces cost, and it offers integration advantages compared to other semiconductor and MEMS technologies.

Compared with GaAs and GaN, the ability to integrate logic offers the best integration capability, which is a benefit for space-constrained PCB designs. Infineon characterizes MEMS as having low switching speed and weak repeatability and reliability, eliminating it for many applications.

More information on Infineon’s bulk CMOS switch family is available at

“With its proven expertise and legacy in semiconductor manufacturing, Infineon became a preferred partner of all original equipment and design manufacturers and chipset distributors. The overwhelming market acceptance underlines our radio frequency front-end system understanding, our technical strength, superb quality and supply assurance interwoven into Infineon’s production strategies.” — Philipp von Schierstaedt, vice president and GM for Infineon’s RF systems group