Rogers Corporation is pleased to introduce ARLON® raPId™ polyimide substrates, a new, innovative solution for streamlining manufacturing and improving performance of flexible heater applications. Designed with a revolutionary new construction, raPId™ substrates incorporate the benefits of polyimide heater dielectrics with the flexibility and usability of a silicone adhesive system.
Replacing traditional acrylic or fluorinated ethylene propylene (FEP) adhesive systems, ARLON raPId substrates combine polyimide film with a unique silicone adhesive that processes in less time and at lower temperatures and pressure. These features make a big difference during manufacturing as the innovative thermosetting silicone adhesive system locks the foil-etched circuit in place, minimizing circuit “swimming” during capping, while minimizing delamination and voids. By streamlining processing, ARLON raPId substrates reduce cure temperatures, pressures and cycle times, resulting in lower manufacturing cost and higher product value.
Available in both etched-foil and wire-wound dielectric offerings, ARLON raPId substrates are ideal for high-reliability applications as a replacement for acrylic or FEP adhesives in polyimide flexible heaters. In applications where temperature control is vital, these unique substrates can be used to maintain temperatures in analytical test equipment with a chemical-resistant heater or in outdoor electronics requiring cold weather operation via ultra-low-profile heater constructions. Their robust construction is also attractive for low-weight heaters for aerospace applications where protecting devices against cold temperatures at high altitudes is critical. For medical equipment requiring faster-response-rate heating systems, these innovative substrates can improve reliability and performance, while minimizing processing challenges.
Tim Wilson, Rogers’ market segment manager for the ARLON suite of products, states, “We’re excited to be introducing raPId Flex Heater Dielectric. By combining the technologies of a polyimide heater dielectric with the robustness of silicone adhesives, raPId substrates are the solution of choice for applications in which temperature control is mission-critical.”