EDI CON China 2018, the conference that brings together engineers working on high-frequency analog and high-speed digital designs and takes place March 20-22, 2018 at the China National Convention Center in Beijing, announces the Call for Abstracts for its technical sessions is open. All submitted abstracts will be evaluated by the EDI CON CHINA 2018 Technical Advisory Committee for quality and educational relevance for conference attendees.
In its sixth year, EDI CON China 2018 will include technical conference sessions as well as workshops, panels, keynotes, poster sessions and demonstrations from industry leading exhibitors in the RF, microwave and high-speed digital industries. Authors wishing to submit and abstract can do so here: www.ediconchina.com/cfa. Talks can be given in English, and the event will provide real-time translation into Chinese. (Talks can also be given in Chinese.)
Focused on providing actionable information to practicing engineers, EDI CON offers specialized conference tracks to appeal to engineers looking for in-depth technical information to address today’s design challenges. Planned tracks include RF & Microwave Design, Mobile Front End Design, Low Power RF & IoT, 5G & Advanced Communications, Broadband Networks, Radar & Defense, Amplifier Design, Signal Integrity, Power Integrity, EMC/EMI, Simulation & Modeling and Test & Measurement.
To be selected as part of the EDI CON China 2018 technical program, abstracts must provide a sufficient level of technical detail for the Technical Advisory Committee. Submissions should be high quality and detailed, aimed at advancing the knowledge of attendees. Abstracts will be evaluated on quality, relevance, impact and originality. While prospective authors can reference products in a design case study or as a proof of concept for a design methodology, overt commercial content is not acceptable in session proposals.
Abstracts will be accepted until November 30, 2017 through the online portal system: www.ediconchina.com/cfa.