Richardson RFPD, Inc. announced its attendance and participation at Electronic Design Innovation Conference (EDI CON) 2017, including its sponsorship of the GaN Panel workshop. EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers.

EDI CON 2017 will be held from April 25th through 27th at the Shanghai Convention & Exhibition Center of International Sourcing in Shanghai, China. Richardson RFPD's GaN Panel is scheduled for Wednesday, April 26th, 14:50 to 15:30 (local time), in Room 302A.

This year’s GaN Panel is entitled “The Future Outlook of RF GaN: Applications and Performance.” The proliferation of GaN in commercial RF applications is reaching a critical mass, which creates a virtuous cycle as the price/performance tradeoffs open even more opportunities to use GaN. The participants in the panel represent several companies invested in RF GaN, and multiple points of view will be discussed. Panelists include MACOM, NXP, Strategy Analytics and Wolfspeed. The panel will be moderated by Gary Lerude, Technical Editor of Microwave Journal. Richardson RFPD will also feature several of its industry-leading suppliers at its booth, including Analog Devices, Huber+Suhner, MACOM, Microsemi and NXP. Additional details are available online.