EDI CON China 2016 took place April 19-21 in Beijing at the China National Convention Center (CNCC). Continuing on a strong trajectory of growth, EDI CON China achieved a 35 percent increase in attendees and 32 percent increase in exhibition space over 2015. This year’s conference included partnerships with the China Radar Industry Association Conference and EMC China Conference/Exhibition.

“With more than 3,100 unique attendees, many of whom attended all three days, this year’s EDI CON China delivered on its promise to bring together the latest electronic design innovation techniques and products in a single venue in China,” said Ivar Bazzy, president of Horizon House, the conference’s organizer. “In an effort to expand our reach to more engineers in China, next year we will hold EDI CON China in Shanghai, returning to Beijing in 2018.”

The technical sessions were organized around tracks focused on RF, microwave, and high-speed digital design, modeling and measurement, EMC/EMI, radar and systems engineering. EDI CON China 2016 also included a 5G forum as well as a new silicon on insulator (SOI) technology track.

Next year’s event, EDI CON China 2017, will be held at the Shanghai Convention & Exhibition Center of International Sourcing in Shanghai, China on April 25-27, 2017. EDI CON China will return to Beijing in 2018. More information, including an application to exhibit, is available at www.ediconchina.com.


EDI CON China celebrates electronic design innovation, bringing together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON to find solutions, products, and design ideas that they can put into immediate practice for today's communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, with special focus on EMC and Radar through its partnerships, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges.

The exhibition hall features product displays, demonstrations, networking opportunities, and poster sessions that address all aspects of design, simulation, test, and verification.

For more information about EDI CON China, please visit www.ediconchina.com.


Sales Contacts:


Mark Mak

+852 28386298



North America:

Carl Sheffres





Richard Vaughan

+44 207 596 8742



Editorial Contacts:

EDI CON China:

Horizon House Publications (rep. by ACT)

Winson Xing

+86 156 1183 2959



EDI CON International:

Janine Love, Technical Conference Coordinator

+1 857-350-2216


Twitter: @tb_janine