EDI CON USA 2016, taking place September 20-22 in Boston, Mass. at the Hynes Convention Center, is pleased to announce their Call for Papers. Authors are invited to submit technical oral session abstracts/proposals describing work in RF/microwave, EMC/EMI and high-speed digital electronic component or system-level design, modeling or testing. The EDI CON Technical Advisory Committee will review all submissions based on quality, relevance, impact and originality. Prospective authors are welcome to reference products in a design case study or as a proof of concept for a design methodology, as long as product references are presented in an appropriately non-commercial fashion. The deadline for abstract submissions is February 28. Detailed information on formatting and instructions for submitting an abstract or paper are available at www.ediconusa.com/papers2016.

Building on three successful years in China, the new EDI CON event platform is launching in the USA starting in Boston, Mass. where there is a high concentration of electronic design engineers including both high-frequency and high-speed digital designers. Organizers expect to attract more than 3000 attendees during the 3-day event with close to 100 paper sessions and more than 30 workshops and panels. The technical sessions will be organized around tracks focused on RF, microwave and high-speed digital design, RF/MW modeling and measurement, EMC/EMI, high-speed digital modeling and measurement, system-level measurements and modeling, and systems engineering. A full day 5G Forum on future communications technologies, track on the Internet of Things (IoT) and several tracks on aerospace, defense and space related topics will be featured in the conference. More than 60 companies have already signed up for the 2016 exhibition with more than 100 companies expected to participate. For more information about EDI CON USA 2016, please visit www.ediconusa.com.


EDI CON USA is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace/defense and related markets. The technical program and exhibition include the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. The conference will feature the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks, such as small cell infrastructure, SATCOM and microwave backhaul.

About Horizon House

Horizon House is an experienced and well-established organizer of targeted events, including EDI CON China, European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA), and several major microwave related conferences/exhibitions such as the RF/Microwave, M2M and Microwave Backhaul Zones at Super Mobility Week (CTIA).

Microwave Journal is promoting and publicizing EDI CON USA in association with other industry media, such as and other professional organizations to local and international engineers, technology companies and academia, while also providing input from, and a link to, the wider high speed, high frequency, RF and microwave community.


North America:
Pat Hindle
+1 781 619 1946
Twitter: @pathindle

Richard Mumford
+44 207 596 8787