MATERIALS
RF Protective Clothing
This RF protective clothing provides improved personnel protection within RF and electro-magnetic fields, allowing employees to work safely in ambient RF fields significantly above IEEE C.95.1-1992 MPE levels. The RF protective suit's fabric incorporates a yarn that consists of stainless-steel microfibers in a cotton/polyester base. The clothing features a shielding effectiveness of up to 60 dB at frequencies in the range from 2 MHz up to 10 GHz, facilitating ANSI C95.1 compliance in RF levels as high as 125 mW/cm2. In addition, the clothing is flame retardant, durable and comfortable and can be machine washed or dry-cleaned. Currently available are full-body coveralls with integrated hood, gloves and socks.
Holaday Industries,
Eden Prairie, MN
(612) 934-4920.
High Density Chip Packages
The Via on Chip Pitch series packages represent a new category of semiconductor chip packaging that provides high performance application-specific IC and microprocessor suppliers good density and electrical performance. The substrates are developed from a platform combining the company's MICROLAM organic dielectric material with state-of-the-art laser via formation and photolithography. The packages are designed for use in performance-driven flip-chip applications.
W.L. Gore & Associates Inc.,
Newark, DE
(800) 414-4465.