Organizers of the Electronic Design Innovation Conference (EDI CON) have signed a contract with the China National Convention Center (CNCC) to host this industry-driven event for RF, microwave and high speed digital electronic designers on April 14-16, 2015 in Beijing, China. The venue change is necessary to accommodate the expected growth in the number of vendors participating in the exhibition next year. The success of the event this past April, which included record attendance and a sold out exhibition, led to the decision to move the event to the larger, newer facility.
As an event focused on connecting engineers with commercial solutions for RF, microwave and high-speed digital design, the EDI CON organizers believe it is imperative that conference delegates are able to interact closely with the technical experts from exhibiting companies, many of whom will be presenting technical papers and workshops. The reserved space at the CNCC includes adjacent conference rooms and exhibition hall to ensure the exchange of information between delegates and vendors.
In addition, the CNCC will allow exhibitors to promote their company’s products and services in a world-class venue with the modern amenities necessary to host this professional event. Situated in the center of the Olympic commercial circle between Beijing's fourth and fifth ring roads, the CNCC is easily accessible to local and travelling visitors and exhibitors alike. A subway station is located in the CNCC's basement allowing delegates to bypass Beijing traffic and arrive without delay from the city center, the airport, the Beijing Railway station, the central business district, and China's Silicon Valley Zhongguancun. Visiting delegates and exhibitors will also have easy access to tourist attractions such as Tian'anmen Square, Forbidden City or Summer Palace.
Entering its third year, EDI CON is a 3 day conference and exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The technical program and exhibition includes the leading international RFIC, component and material manufacturers, semiconductor foundries, EDA software and test equipment/solution providers. This year’s conference features the most recent trends in high-frequency electronics and wireless communication technology, addressing all aspects of design, simulation and test verification through an understanding of system requirements for wireless communication networks such as small cell infrastructure, SATCOM and microwave backhaul.
About EDI CON 2015
EDI CON is an industry-driven conference/exhibition targeting RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators developing products for today's communication, computing, RFID, wireless, navigation, aerospace and related markets. The integrated technical program and exhibition presents hands-on, practical solutions for enhancing physical design at the semiconductor, module, PCB and system-levels, bringing together designers at the forefront of Chinese innovation and the world's leading technology companies.
For information on the conference program, ongoing updates and major announcements and to register for EDI CON 2015 visit:
www.EDICONCHINA.com.