Hesse & Knipps Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, a manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep – Chalman Technologies – in Anaheim, Calif. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, Mass.

Hesse & Knipps’ western region customers can now more conveniently test and troubleshoot applications on Hesse & Knipps’ Bondjet BJ 820 High-Speed Fully Automatic Fine Wire Wedge Bonder, the fastest wedge bonder on the market, while prospective customers can validate the capabilities and qualify Hesse & Knipps wedge bonders prior to making a purchase. Hesse & Knipps applications engineers staff the Demo and Applications Lab, working directly with customers.

“We are very pleased to partner with Chalman Technologies to bring our new applications lab to western region customers and prospects. Rather than fly across the country, western region customers can now more readily test new and existing applications using our latest wedge bonder technology,” notes Joseph Bubel, president of Hesse & Knipps Inc. “Chalman Technologies offered an ideal location that was close to our western region customer base and the growing RF and microwave market.”