Chandler, Arizona – Oct. 25, 2011 - Rogers Corporation (NYSE:ROG), a leading supplier of high performance printed circuit boards for use in high frequency applications and harsh environments, including defense, aerospace, telecommunications and automotive will showcase some of its materials at the upcomingProductronica 2011( November 15-18, in the New Munich Trade Fair Centre in Munich, Germany. Rogers Corporation will be on hand ( Booth 401 in Hall B1) to explain the advantages of its RT/duroid® 6035HTC, SYRON™, XT/duroid™ and RT/duroid 5880LZ laminates for use in a wide range of electronic circuits.

Visitors will learn about the benefits of these three high-performance laminate materials in a broad range of electronic products. Rogers RT/duroid 6035HTC laminates are ideal for high-power RF/microwave applications, such as antenna beam-forming networks and power amplifiers for wireless cellular communications networks. The high-thermal-conductivity (HTC) fluoropolymer composite contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K, while maintaining low drill wear versus other competitive offerings. The thermally stable material has a z-axis dielectric constant of 3.5 at 10 GHz, low loss by virtue of a loss tangent of 0.0013 at 10 GHz, and is available with reverse-treated, electrodeposited copper foil.

Environmentally friendly, SYRON 7000/ 7100 and XT/duroid 8000/8100 circuit materials are engineered for applications through microwave frequencies that require outstanding stability at high temperatures and in harsh chemical environments. These thermoplastic materials feature a higher melt temperature than PTFE and they are inherently flame retardant, per UL 94 VTM-O flammability classification testing. SYRON and XT/duroid materials are resistant to the solvents and reagents commonly used in PCB processing and can operate in harsh chemical environments. The materials offer somewhat different electrical characteristics but all are available with ½-oz. very-low-profile electrodeposited copper foil cladding and in several standard panel sizes, including 12 x 18 in. (305 x 457 mm) and 24 x 18 in. (610 x 457 mm). These materials are suitable for flex-to-install applications, lightweight feed manifolds, automotive sensors, and in electronics for oil and gas exploration. XT/duroid 8100 possesses properties often sought by engineers designing airborne lightning strike protections systems.

In addition, when high electrical performance versus weight is critical, Rogers RT/duroid 5880LZ laminate materials feature the industry’s lowest available dielectric constant of 1.96 in the z-axis at 10 GHz with a TCDk of +22ppm/ºC. RT/duroid 5880LZ is also light weight, having a specific gravity of 1.3 – 1.4, making it suitable for airborne satellite applications. These materials offer low loss, evidenced by a dissipation factor of typically 0.0019 at 10 GHz. Usable at satellite frequencies to Ku-band and beyond, these RoHS-compliant circuit materials feature a low z-axis coefficient of thermal expansion (CTE) of 41.5 ppm/ºC for reliable plated through holes (PTHs) in multilayer circuits. To learn more about these and other high-performance circuit laminate materials, join Rogers Corporation in Munich atProductronica 2011.

For more information visit the company’s website by clicking the link below our logo on this page.