We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
Df is important for prediction of insertion loss in passive devices. If insertion loss is higher than predicted, then power transfer through a device may be too low and a higher power transmitter or more elements would be necessary. Presented here are four methods of extracting Dk and Df from dielectric samples of an unknown material and the pros and cons of each.
GRIN dielectric lenses/antennas have been a hot topic of research for virtually every microwave/mmWave application, from military/defense, aerospace/space, to commercial telecommunications. There have even been several companies, products, and government/DoD grants using GRIN dielectric lens/antenna technology. This article provides some discussion around recent research (since 2018) on GRIN dielectric lenses/antennas, and an overview of GRIN dielectric lenses/antennas being deployed or intended for practical use.
The barriers to entry of developing and deploying mmWave communication and sensing technologies has largely been a result of the design and manufacturing complexity which tends to increase as a function of frequency. There are several key factors - learn about them in this article.
This article is from Chapter 4 of the eBook "The Printed Circuit Designer's Guide to...Thermal Management: A Fabricator's Perspective" authored by Anaya Vardya, CEO, American Standard Circuits, and published on iConnect007 here.
Trackwise has shipped a 26 meter long multilayer, flexible printed circuit (FPC), believed to be world’s longest ever produced, for distributing power and control signals across the wings of a solar-powered, unmanned aerial vehicle (UAV). The circuit is one of over fifty supplied by Trackwise into this vehicle.
AT&S is supporting the current roll-out of the 5G mobile communications generation with high frequency (HF) optimized interconnect solutions and will continue to offer corresponding solutions as the new standard develops.
University of Glasgow engineers have scaled up the established processes for making flexible silicon chips to the size required for delivering high-performance bendable systems.
The University of Bristol has been awarded a £4.3 million grant from the Engineering and Physical Sciences Research Council to lead a new project to develop GaN-on-Diamond microwave technology.
Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to alesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.
Whenever time to market is critical, rapid
prototyping can produce a first draft of a new product that allows testing, evaluation, and further refinement
of the product idea, which helps a company more quickly and cost-effectively transform early concepts into
marketable products. At the same time, for concepts that may not make practical products, rapid prototyping
can spare a company further investment time and expenses by revealing the product's flaws at an early stage
of the development process.
This white paper discusses a
variety of RF materials and
substrates capable of meeting
RF Front-End module
designersââ¬â¢ requirements.
You will gain insight into how
state-of-the-art expertise in
substrate technology can
enable the mobile devices of
the next decade.
Subscribe
The University of Bristol has been awarded a £4.3 million grant from the Engineering and Physical Sciences Research Council to lead a new project to develop GaN-on-Diamond microwave technology.
