Teledyne Microwave Solutions has invested in the Teledyne Labtech facility at Presteigne, Wales, following the recent completion of the installation of the new Shadow Line processing equipment in support of increased production requirements.
Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film (PCTF®) metallization, has completed a new, comprehensive web site www.remtec.com that strengthens Remtec's position as the leader in providing ceramic solutions for DC power electronics, optoelectronics and RF/MW applications.
T-Tech Inc. and The Geek Group announced a joint agreement to offer a state of the art solution and facility for rapid printed circuit board (PCB) design, verification, and fabrication. The collaboration will combine T-Tech's QCJ5 series Quick Circuit System and IsoPro® Software for PCB prototyping with The Geek Group's expertise and 43,000 square foot Leonard Street Labs Facility in Grand Rapids, Michigan.
Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and Technology Conference (ECTC) May 27-30 in Lake Buena Vista, Florida.
Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.
Attendees of the 2014 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made live and in-person by visiting LPKF Laser & Electronics in booth #1108. LPKF has announced that they will be debuting the first ever hybrid milling/laser prototyping system, the ProtoMat D104. Also at the show will be a UV laser prototyping system, the ProtoLaser U3. The show will be hosted in Tampa, FL., June 3-5 at the Tampa Convention Center.
Rogers Corp. held a ribbon-cutting ceremony to dedicate the company’s new Innovation Center in Burlington, Massachusetts on March 25. More than 125 government officials, community leaders, technology company representatives and other guests were on hand to celebrate and tour the Center, which is located within Northeastern University’s George J. Kostas Research Institute for Homeland Security.
Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to alesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.
Whenever time to market is critical, rapid
prototyping can produce a first draft of a new product that allows testing, evaluation, and further refinement
of the product idea, which helps a company more quickly and cost-effectively transform early concepts into
marketable products. At the same time, for concepts that may not make practical products, rapid prototyping
can spare a company further investment time and expenses by revealing the product's flaws at an early stage
of the development process.
This white paper discusses a
variety of RF materials and
substrates capable of meeting
RF Front-End module
You will gain insight into how
state-of-the-art expertise in
substrate technology can
enable the mobile devices of
the next decade.