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Materials/Packages

Materials/Packaging related products

ARTICLES

SemiGen's automated PCB assembly outsource handles VGAs and more

April 18, 2014

SemiGen Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, provides high-quality, automated PCB assembly for high-mix, low- to medium-volume printed circuit boards.


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Agilent installs atomic force microscope at Cambridge Graphene Centre

January 27, 2014

Agilent Technologies announced the recent installation of an Agilent 5600LS atomic force microscope with scanning microwave microscopy at the Cambridge Graphene Centre (CGC), in the UK.


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Soitec manufactures new eSI substrates for 4G LTE advanced smartphones

December 9, 2013

Soitec has reached high-volume manufacturing of its new Enhanced Signal Integrity™ (eSI) substrates, enabling cost-effective and high-performance RF devices. The eSI products are said to be the first ‘trap-rich’ type of material in full production.


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NXP introduces first 3 A transistors in 1.1 mm² leadless plastic package

November 4, 2013

NXP Semiconductors has introduced the first transistors in a 1.1 mm by 1 mm by 0.37 mm low-profile discrete flat no-leads (DFN) package that boost current capabilities up to 3.2 A.


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Nujira selects ASE as packaging and test partner for handset ET chip

RFIC
September 9, 2013

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.


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Isola expands production of RF/microwave materials in Germany to support European OEMs

July 15, 2013

Isola Group S.a.r.l.announced that its six-member IS680 copper-clad laminate family is now in production at its facility in Dueren, Germany.


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PCB Considerations For Defected Structures

April 4, 2012
As strange as it may sound, the use of circuit defects is a growing trend in high-frequency circuit design, especially for passive circuits such as filters. More precisely, the trend is in the increased use of defected ground structures (DGSs) and defected microstrip structures (DMSs) to alter the responses of microstrip circuit designs. Just what are these DGS and DMS forms, and does incorporating them into a high-frequency circuit change the way the PCB material should be specified?
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Learning To Launch Onto Different Circuit Thicknesses

March 20, 2012
The transition, from a waveguide or coaxial connector to the PCB, is critical to the performance of the circuit, and the PCB’s thickness can impact how an end launch transition is made. Waveguide and coaxial connectors come in many shapes and sizes, as do PCB thicknesses, and matching the connector to the substrate thickness can play a large role in the overall performance and reliability of that design.
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Plessey Semiconductors sensor product of UK’s NanoKTN project

March 12, 2012

The UK’s Nanotechnology Knowledge Transfer Network (NanoKTN) announced details of a product developed by Plessey Semiconductors, as part of a project co-funded by the Technology Strategy Board (TSB), with support from the NanoKTN and JEMI UK.


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MSC distributes Precision Devices' Products in DACH region

March 5, 2012

In order to better serve customer demand for high-end crystals, voltage controlled crystal oscillators (VCXO), temperature compensated crystal oscillators (TCXO), oven controlled crystal oscillators (OXCO) and crystal filters, MSC Vertriebs GmbH has signed a distribution agreement for Germany, Austria and Switzerland (the DACH region) with Precision Devices UK Ltd.


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DOCUMENTS AND FILES

CVD Diamond High Power Resistors and Terminations

December 15, 2012

Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to alesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.

Bringing Rapid Prototyping In-House

August 13, 2012
Whenever time to market is critical, rapid prototyping can produce a first draft of a new product that allows testing, evaluation, and further refinement of the product idea, which helps a company more quickly and cost-effectively transform early concepts into marketable products. At the same time, for concepts that may not make practical products, rapid prototyping can spare a company further investment time and expenses by revealing the product's flaws at an early stage of the development process.

RF Substrate Technologies for Mobile Communications

June 13, 2012
This white paper discusses a variety of RF materials and substrates capable of meeting RF Front-End module designers’ requirements. You will gain insight into how state-of-the-art expertise in substrate technology can enable the mobile devices of the next decade.

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