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Industry News

ARTICLES

RJR Technologies announces shipment of over 10 million ACP packages

RJR Technologies, a leading developer of high performance Air Cavity Plastic (ACP) packaging, announced that it has shipped over 10 million ACP packages. As a high volume manufacturer of semiconductor packaging for RF and microwave markets, RJR’s milestone reflects the increasing use of plastic packages in high performance, high frequency RF applications.


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Richardson Electronics at IMS2016

Disruptive technologies and products featured in the “Think Tank” at Booth #2350

Richardson Electronics Ltd. announces its participation at the 2016 IEEE International Microwave Symposium (IMS2016). IMS2016, organized by the IEEE Microwave Theory and Technique Society (MTT-S), is the premier conference for attendees to learn about the latest information in the RF and microwave industry.


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Laser Services to exhibit at IMS2016

Laser Services, an ISO 9001:2008 - AS9100C and ITAR registered laser job shop, will be exhibiting at the 2016 International Microwave Symposium (IMS) in San Francisco, Calif., being held from May 22–27, in booth #1853. They will be discussing their services and techniques for RF and microwave applications.


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Ardent Concepts releases industry's highest bandwidth multicoax connector

Ardent Concepts Inc., a leading designer and manufacturer of high performance GHz connectors used in the development of next generation semiconductor applications and systems has again pushed bandwidth barriers with a 70 GHz configuration of its innovative TR Multicoax series connectors. TR 70 realizes Ardent’s mission to bring tomorrows connector solutions to market today. With exceptionally low loss, TR 70 ensures quicker, more accurate, and more repeatable functional test of cutting-edge IC applications.


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IoT to account for 28 percent of wireless connectivity IC market by 2021

ABI Research, the leader in transformative technology innovation market intelligence, finds that smart home, beacon, wearable, and other nascent IoT applications including energy management and smart cities are to propel the wireless IoT connectivity market forward. The market’s trend toward multi-protocol connectivity IC adoption will ease development time, boost scale, and reduce complexity and cost for manufacturers across these different sectors in the years ahead.


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