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Items Tagged with 'automatic'

ARTICLES

Hesse Mechatronics debuts dual-head wedge bonder in the Americas

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.


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LPKF to host PCB prototyping demo at MTT-S

Attendees of the 2013 International Microwave Symposium (IEEE MTT-S) Exhibition will have the opportunity to see printed circuit boards made live and in-person by visiting LPKF Laser & Electronics in booth 2215. The in-house rapid PCB prototyping specialist has announced that they will be demonstrating two PCB prototyping systems at the exhibition, which takes place at the Washington State Convention Center in Seattle, Wash., June 4-6.


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Hesse launches heavy wire and ribbon bonding services for product development

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.


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Redline launches Nomadic Virtual Fiber System using solid state smart antenna technology

Redline Communications (www.rdlcom.com) Group Inc., a leading provider of broadband wireless solutions for industrial machine-to-machine (M2M) communications, announced the availability of the RAS Smart Antenna System. The solid state RAS is the first wireless broadband networking system that instantly locates, steers toward and connects to a network base station, automatically establishing reliable high speed connectivity to and from roving assets.


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