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Items Tagged with 'automatic'

ARTICLES

IKE Micro completes in-house air cavity array packaging capability

March 18, 2014

IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies. 


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SemiGen’s full-service RF/Microwave assembly smooths out and speeds up manufacturing

March 13, 2014

SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, is announcing its full-service, high-quality, RF/Microwave design and automated assembly services as a viable option for companies looking to reduce assembly cost while keeping their production domestic.


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Hesse Mechatronics debuts dual-head wedge bonder in the Americas

June 6, 2013

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.


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LPKF to host PCB prototyping demo at MTT-S

May 7, 2013
Attendees of the 2013 International Microwave Symposium (IEEE MTT-S) Exhibition will have the opportunity to see printed circuit boards made live and in-person by visiting LPKF Laser & Electronics in booth 2215. The in-house rapid PCB prototyping specialist has announced that they will be demonstrating two PCB prototyping systems at the exhibition, which takes place at the Washington State Convention Center in Seattle, Wash., June 4-6.


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Hesse launches heavy wire and ribbon bonding services for product development

May 6, 2013

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.


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AMETEK becomes only power supply company supporting standard DOD ATS families across all four military branches

March 14, 2013

AMETEK Programmable Power, the global leader in programmable AC and DC power test solutions, announces that its ReFlex Power™ (RFP) System is now qualified for use in standard Department of Defense (DoD) Automated Test Systems (ATS) across all major military branches.


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Redline launches Nomadic Virtual Fiber System using solid state smart antenna technology

August 8, 2012

Redline Communications (www.rdlcom.com) Group Inc., a leading provider of broadband wireless solutions for industrial machine-to-machine (M2M) communications, announced the availability of the RAS Smart Antenna System. The solid state RAS is the first wireless broadband networking system that instantly locates, steers toward and connects to a network base station, automatically establishing reliable high speed connectivity to and from roving assets.


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