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Items Tagged with 'high-frequency'

ARTICLES

Vishay on display at IMS 2014

Vishay Intertechnology Inc.
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At IMS 2014, Vishay will be highlighting its VJ HIFREQ series and VJ QUAD HIFREQ series of surface-mount multilayer ceramic chip capacitors (MLCCs). Offering high self resonance and a low dissipation factor of = 0.05 % in the 0402, 0603, and 0805 case sizes, devices in the VJ HIFREQ series are optimized for filter and matching networks, and amplifier and DC blocking circuits in high-frequency commercial applications. The MLCCs reduce signal loss and energy consumption in power amplifier modules, VoIP networks, cellular base stations, GPS systems, and satellite, WiFi (802.11), and WiMAX (802.16) wireless communication. The VJ HIFREQ series features broad working voltages from 25 VDC to 250 VDC and wide capacitance ranges from 1 pF to 1.5 nF.

 


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Harris showcases emerging capabilities in high-frequency tactical communications

Harris Corp.
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Harris Corp. has successfully created a high-frequency (HF) tactical radio network that linked U.S. military bases in four states and provided clearer communications and greater capabilities than traditional HF solutions.


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AWR jointly hosts high-frequency design, simulation and test workshop in Brazil and Argentina

AWR Corp.
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AWR Corp., the innovation leader in high-frequency EDA Software, is co-hosting with CST and National Instruments a complimentary series on high-frequency design, simulation, and test workshops in Brazil and Argentina this month.


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Rogers to offer material solutions for high-frequency, high-thermal-reliability & multilayer circuits at PCB West 2013

Rogers Corp.
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Rogers Corp. will have representatives available to discuss electronic printed-circuit-board (PCB) material solutions at the PCB West Exhibition (http://pcbwest.com), September 25, 2013, in the Santa Clara Convention Center in Santa Clara, CA (Booth #200).


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DuPont Circuit & Packaging Materials and IQLP to develop high-speed circuit technology

DuPont Circuit & Packaging Materials and IQLP LLC
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DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.


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AWR Design Forum (ADF) 2013 agendas announced and registration opens for Korea and Japan

AWR Corp.
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AWR, the innovation leader in high-frequency EDA software, has finalized the agendas and opened registration for the summer AWR Design Forums (ADF) 2013 being held in Seoul, Korea on Monday, July 8th and Tokyo, Japan on Friday, July 12th.


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Premix launches PREPERM product family with tailored dielectric properties

Premix Oy
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Premix, the leading specialist in conductive plastics, launches the PREPERM® product family with customizable dielectric properties for high-frequency applications. The new product range provides high-frequency device manufacturers with an outstanding material that maximizes performance without increasing overall costs. PREPERM grades can be cost-effectively injection molded to high frequency antenna parts.


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Anritsu to demo broadband VNA system from 70 kHz to 140 GHz at IMS 2012

Anritsu Co.
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Anritsu Co. announces it will demonstrate the world’s only broadband Vector Network Analyzer (VNA) system that can conduct single sweeps from 70 kHz to 140 GHz in its booth (#807) at the International Microwave Symposium (IMS), to be held June 19-21, in Montreal. The on-wafer device characterization is one in a series of demonstrations to be conducted in Anritsu’s booth that will highlight test solutions for high-frequency designs, including E-band applications and high-speed signal integrity measurements.


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