We use cookies to provide you with a better experience. By continuing to browse the site you are agreeing to our use of cookies in accordance with our Privacy Policy.
With release of the latest version of Release 8 of the 3rd Generation Partnership Project (3GPP) in June 2009, the core LTE specification has stabilized. 3GPP Release 8 also encompasses a considerable number of interim enhancements embodied in Evolved High-Speed Packet Access (eHSPA), also known as HSPA+.
In today’s world of highly complex Printed Circuit Board (PCB) designs, designing to meet electromagnetic compatibility (EMC) targets is a necessity. A step that is often times neglected during the early design stage is the design of a robust power delivery network (PDN).
For more than 60 years, microwave technology has been synonymous with Microwave Integrated Circuits (MICs). The first MICs appeared in the 1940s, just over a decade after the first microwave circuits were introduced in waveguide form. Now, even though monolithic MICs (MMICs) have revolutionized (and made possible) most of today’s wireless-enabled devices, products based on MIC fabrication techniques remain the bulk of the output of the microwave industry.
