White Papers

This white paper, written by EM expert Dr. John Dunn, demonstrates the importance of correctly selecting and assigning “ground” within EM simulators and how it is essential for successfully predicting the performance of board, package, and their associated interconnects.

This application note describes the installation and use of the R&S MATLAB® Toolkit on Microsoft Windows and Linux based systems.

Understanding Available Tools for RF System-in-Package and Multi-Chip-Module Design and Optimization

Transim white paper

Rochester Electronics, George Karalias, Director of Marketing and Communications

by Motorola

by Starling Advanced Communications

As technology has advanced, tools have been developed that go beyond merely analyzing devices to tools that design devices. These tools allow the user to select basic structures with variable dimensions, size constraints, and performance goals and then iterate automatically until the best possible design is found. The user is freed from the burden of monitoring the progress of each individual simulation and can devote time to other tasks. This evolutionary step in simulation software is improving the productivity of engineers developing nextgeneration devices in a variety of fields.

This application note describes the R&S ZVA_110 converters, which extend the frequency range of the R&S ZVA family of vector network analyzers to cover the millimeter-wave range.

In building a strategy for effective integrated-circuit design, it is important to understand the characteristics of different RF and microwave printed beam forming networks (BFN). Optimization of the design process for BFN can reduce unnecessary costs and design iterations, thus allowing designers time to improve the quality of the product. The design process includes various stages from analysis of requirements to final design documentation, balancing and trading off factors such as electrical performance, size, cost, etc.