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ARTICLES

Interconnects for a Multi-layer Three-dimensional Silicon Architecture

Development of lateral and vertical interconnects for K- through W-band applications using silicon micromachining
May 1, 2001
TECHNICAL FEATURE Interconnects for a Multi-layer Three-dimensional Silicon Architecture As low cost and low volume gain increasing importance in today's technology market, the development of lateral and vertical interconnects for K- through W-band applications using silicon micromachining is a worthwhile endeavor. Thus, lateral components appropriate for multi-layer applications, such...
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