Ted Rappaport, founding director of NYU WIRELESS and a leading proponent of using the millimeter wave spectrum for wireless communications, discusses the FCC's recent rulemaking actions and technology developments that are paving the way to 5G.
Indium Corp.'s new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Indium Corp. has hired two new engineering managers, Carmen Salvatore and (James) Jung Jin-Young. Salvatore will provide leadership and direction to the engineering team at the company’s Business Park Drive facility in Utica, N.Y. Jung will oversee the engineering and quality teams at the company’s facility in Cheongju, Korea.
Indium Corp. will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif.
Indium Corp. announces that Brian Reid has joined the company as vice president of operations. Reid is responsible for managing operations to achieve superior productivity, efficiency, quality, capability, and delivery.
Indium Corp. recently released RMA-155 Pb-free solder paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.