Indium Corp. has released a new solder research kit designed for soldering to gold plating using indium-based alloys. Gold is often used in electronics assembly because it resists oxidation and solders readily. This makes gold ideal for plating contact surfaces for switches and connectors.
Indium Corp.'s new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.
Indium Corp. has hired two new engineering managers, Carmen Salvatore and (James) Jung Jin-Young. Salvatore will provide leadership and direction to the engineering team at the company’s Business Park Drive facility in Utica, N.Y. Jung will oversee the engineering and quality teams at the company’s facility in Cheongju, Korea.
Indium Corp. will feature NC-26-A Ultra-Low Residue No-Clean Flip-Chip Flux at the 47th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), Oct. 14-16 in San Diego, Calif.
Indium Corp. announces that Brian Reid has joined the company as vice president of operations. Reid is responsible for managing operations to achieve superior productivity, efficiency, quality, capability, and delivery.