Home » Authors » Jean-Pierre Bertinet, Eddie Leleux and Jean-Pierre Cazenave, THALES Microelectronics; Jean-Pierre Ganne, Michel Paté and Richard Lebourgeois, THALES R

Jean-Pierre Bertinet, Eddie Leleux and Jean-Pierre Cazenave, THALES Microelectronics; Jean-Pierre Ganne, Michel Paté and Richard Lebourgeois, THALES R

Articles

ARTICLES

Filtering Capacitors Embedded in LTCC Substrates for RF and Microwave Applications

This article presents a new solution to build filtering capacitors embedded in low temperature co-fired ceramic (LTCC). A new low loss high-k dielectric (K = 80) tape compatible with DuPont low-k tapes has been developed and used in order to demonstrat...

November 5, 2007

Jean-Pierre Bertinet, Eddie Leleux and Jean-Pierre Cazenave, THALES Microelectronics; Jean-Pierre Ganne, Michel Paté and Richard Lebourgeois, THALES R

0 Comments

With the continuous trend to reduce the size of electronic modules and increase the integration levels, the integration of passive elements within the interconnection board or substrate becomes more and more a key factor. In addition to size reduction, passive integration leads to assembly cost reduction as well as...