Morgan Advanced Materials, a leading manufacturer of electro ceramic products, including piezoelectric ceramics, high voltage and RF capacitors and microwave ceramics, announces the launch of a new range of piezoelectric composite components, ideal for applications where high performance is critical, including medical imaging, doppler flow, and military and commercial sonar.
Molex Inc., one of the world’s leading electronic connector companies, has launched a new product family of MediSpec™ Non-magnetic RF (radio frequency) Contacts and Modules as an extension to its existing line of RF/Microwave interconnect solutions.
Infineon Technologies, together with the German automotive supplier, Hella, has developed innovative radio frequency components for a radar sensor, which reliably monitors the blind spot in the car’s rear section.
High Speed Interconnects (“HSI”), a full service extruder and manufacturer of high performance coaxial cable and assemblies, has recently announced custom, fine-wire and fine-pitch diagnostic imaging assemblies for medical device OEMs producing next-generation ultrasound equipment.
Texas Instruments (TI) announced the industry's first flexible high frequency 13.56 MHz sensor transponder family. The highly integrated ultra-low-power RF430FRL15xHsystem-on-chip (SoC) family combines an ISO 15693-compliant Near Field Communication (NFC) interface with a programmable microcontroller (MCU), non-volatile FRAM, an analog-to-digital converter (ADC) and SPI or I2C interface.