Materials/Packages

RSS

Rogers Corp. , a supplier of high frequency laminates, will feature several high performance solutions from its family of advanced circuit materials at the 2009 Satellite show in Washington DC, March 25-27th (Booth #269). Rogers Corp., Advanced Circuit Materials Division, will announce the launch of two new materials especially...

DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, and CAD Design Software have announced the integration of DuPont™ GreenTape™ low temperature co-fired ceramic (LTCC) materials and manufacturing processes into CAD Design Software’s Electronic Design Automation (EDA) design tools for Ceramic (Hybrid/MCM – LTCC) circuit design. By incorporating the...

The Embedded World 2009 Exhibition and Conference that took place in Nürnberg, Germany from 3 to 5 March seemed relatively oblivious to the current economic turndown. At the time of writing official attendance figures were not available, but with 704 exhibitors representing a 4 per cent increase on 2008...

As one of the first major global events of the year the 2009 GSMA Mobile World Congress was not only eagerly awaited for the technology and evolutionary clues that it would divulge, but also as a barometer of the impact of the global downturn on an industry that has...

IEEE , the world’s largest technical professional society, signed a merger agreement with the honor society Eta Kappa Nu (HKN), a nonprofit, public-service organization comprising nearly 200 university chapters. The merger, which will go into effect by mid-2009 pending final approval, will make HKN the official honor society of...

Rogers Corp. 's Advanced Circuit Materials Division (ACMD) will be exhibiting RO4000®, RO2808™ and ULTRALAM® 3000 advanced high performance laminates at the upcoming IMAPS Device Packaging show to be held at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, AZ on March 10 th and 11 th...

NTT DOCOMO Inc. has successfully developed a trial large-scale-integration (LSI) chip that consumes less than 0.04 W of power yet supports multiple-input multiple-output (MIMO) signal detection and decoding for downlink transmissions at 100 Mbps, the speed required for the forthcoming mobile system known as Super 3G, or LTE, approved...

New Waves: High Frequency Components, Boards and Systems Multi-position Switch The QK series of coaxial multi-position switches feature K type connectors that operate in a frequency range from DC to 40 GHz. Available actuator options include normally open and TTL circuitry with integrated indicator circuits. Terminated models are also...