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ThinKom Solutions, Inc. and SNC have successfully integrated the ThinAir® GT 2517 on SNC’s RAPCON-X aircraft to support SNC’s contractor-owned, contractor-operated service programs.
Mercury Systems, Inc. introduced a system on module (SoM) and 3U SOSA-aligned OpenVPX board powered by Altera’s™ most advanced Agilex 9 Direct RF FPGA chips.
Teledyne e2v announced engineering models of the LX2160-Space 16-core Arm® Cortex® A72 based system on chip (SoC) processor, enabling early project design, hardware and software validation for space-demanding applications.
DARPA has awarded BAE Systems’ FAST Labs™ research and development organization a $12 million contract as part of the High Operational Temperature Sensors (HOTS) program.
The State Department has made a determination approving a possible foreign military sale to the Government of the Netherlands of AIM-120D3 Advanced Medium Range Air-to-Air Missiles and related equipment for an estimated cost of up to $807 million.