RF & Microwave Industry News

Marki Microwave leverages AWR's Microwave Office software for revolutionary mixer design

Software/EDA

AWR Corp. announces that its customer, Marki Microwave has leveraged its high-frequency design software platform to develop a new design and manufacturing flow for successful mixer design. The revolutionary new mixer design flow combines AWR’s Microwave Office® circuit design software and Marki’s patent-pending Microlithic™ mixer manufacturing process, resulting in a 14x reduction in the size of Marki’s mixers and a 5x reduction in design time with the same industry-leading quality and performance as the former handcrafted devices.


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Array Wireless announces new investment and management teams

Array Wireless Inc., a technology leader in the creation of efficient, high linearity microwave power amplifiers, announced a major financial investment in the company by Loma Vista Wireless Inc., and the addition of a seasoned management team to spur new growth initiatives. In addition to a cash infusion for new product initiatives, the company is expanding its facility size and hiring staff to accommodate increased design and production capacity.


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AeroVironment and Alta Devices partner on solar powered unmanned systems

AeroVironment Inc. announced that a recent outdoor test flight of a solar-powered prototype version of the company’s proven Puma AE™ small unmanned aircraft system (UAS), operating with the company’s newest long-endurance battery, lasted 9 hours, 11 minutes – significantly longer than the flight endurance of small UAS being used in the field today. AeroVironment is working with Alta Devices, a Sunnyvale, CA company that provides flexible, portable power that can be embedded into any other material, in the development of the solar Puma AE.


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Mobile network equipment vendors are leading the 3GPP standardization

There are many companies that contribute to 3GPP technologies, including WCDMA/HSPA, LTE, and the EPC; however, only a handful of companies stand out across the board. ABI Research looked at the number of chairmanships, rapporteurships, overall contributions, approved contributions, and discussion papers for 3GPP standards. This was done for RAN1, RAN2, RAN3, RAN4, RAN5, SA1, SA2, SA3, SA4, SA5, CT1, CT3, and CT4 from 2009 through 2012.


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Rohde & Schwarz demonstrates its expertise in T&M at EuMW 2013

European Microwave Week is back in Germany once again. In Nuremberg, Rohde & Schwarz will present its wide range of T&M equipment for microwave applications. Experts from Rohde & Schwarz will also be holding ten workshops and seminars as part of the event program. The following test and measurement highlights will be on display in hall 7A, booth 106 at the NCC:    


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DuPont Circuit & Packaging Materials and IQLP to develop high-speed circuit technology

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.


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