RF & Microwave Industry News

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The trend of miniaturization in electronic components is a given, as it is well documented that consumers want smaller, lighter electronic products with more functionality. This is achieved by either making components on the board physically smaller, using undertab terminations, or by modifying the design to reduce the number...

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...

For this discussion we will differentiate Multi-chip modules (MCM) as essentially dozens of chips interconnected on a small form factor single layer substrate, System-in-Package (SiP) being the 3D chip stacking of bare or packaged chips on a multi-layer substrate and the System-on-Package (SoP) as similar to the SiP with...

Call me an optimist. Despite the current recession and concern about business prospects for at least the first half of 2009, I believe the microwave industry will persevere and become stronger. The proliferation of communication systems in our personal and professional lives gives me confidence that the demand for...

Much of today’s R&D in high-frequency electronics is concerned with squeezing more functionality into a smaller package at an affordable price. While large, complex ICs known as System-on-Chip (SoC) are the choice when production volume is high, multi-chip integration often wins for lower volume and speedier time-to-market. The multi-chip...

Raytheon Co. has successfully completed two significant milestones for the US Air Force’s next-generation Global Positioning System Control Segment, or GPS OCX, establishing a solid foundation and roadmap to keep the program on track and on schedule. “These mark major accomplishments for our entire team and significantly burn-down the...

Lockheed Martin has received contracts totaling $774 M from the US Army Aviation and Missile Command for hardware and services associated with the combat-proven Patriot Advanced Capability-3 (PAC-3) Missile program. These contracts include Fiscal Year 2009 missile production for the US Army as well as the first sale of...

Northrop Grumman Corp.’s advanced fire control products played a key role in the most challenging test to-date of the nation’s Ground-based Midcourse Defense (GMD) system, the nation’s only defense against long-range ballistic missiles. In the system’s first intercept test using multiple sensors (past tests have used only one sensor)...

The Nanotechnology Knowledge Transfer Network (NanoKTN), one of the UK’s primary knowledge-based networks for micro and nanotechnologies, has announced its support for one of the largest funding rounds that has been made available to the sector. A combined total of at least €250 M in co-funded grants is available...