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As we enter December, the MWJ editorial staff is currently busy preparing for next year’s first quarter with contributions from the industry’s leading engineers and scientists. Thanks to their research (and writing), we will be able to keep our readers updated on the latest microwave technologies being introduced. Communication and defense systems continue to proliferate and grow in capability. Thanks to the hard work and creativity of engineers throughout the industry, 2014 should be another banner year for component development and the systems they support.
Well here we are again. Another calendar year drawing to an end, winter and the holiday season are just around the corner and the Journal staff is busy putting the wraps on 2013 and preparing for next year. With much of our editorial already lined up for the first quarter, the industry has once again proved that RF/microwave technology and applications continue to evolve rapidly. The 2014 outlook looks good for component manufacturers addressing advanced radar and communication systems.
Horizon House publications and Microwave Journal China announced that Rohde & Schwarz will be the Diamond sponsor of the Electronic Design Innovation Conference (EDI CON) 2014 in Beijing, China, April 8-10, 2014.
Horizon House and Microwave Journal China announced that Agilent Technologies will be the Host Sponsor of the Electronic Design Innovation Conference (EDI CON) 2014 in Beijing, China, April 8-10, 2014.
Later this month, Microwave Journal Publisher, Carl Sheffres and I will be travelling to Shanghai and Beijing where we will be meeting with many RF/microwave engineers and marketing professionals. The purpose of our trip will be to learn about the state of the industry in China from the perspective of local microwave component vendors and their customers. This exchange is an important step in identifying the authors and topics that will appear in future issues of Microwave Journal China. We will also be recruiting speakers, topics and sponsors/exhibitors for next year’s EDI CON event which will be held April 8-10, 2014 at the Beijing International Convention Center (BICC).
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